公开(公告)号：EP3708631A1

公开(公告)日：2020-09-16

申请号：EP20167117.9

申请日：2010-03-12

申请人： Saint-Gobain Ceramics & Plastics Inc.

发明人： WANG, Jun ,  LACONTO, Ronald ,  HAERLE, Andrew

IPC分类号： C09K3/14 ,  B24B37/00 ,  C09G1/02 ,  H01L21/02 ,  H01L29/16 ,  C01B32/25

摘要： A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 Å/min to achieve a Ra of not greater than about 5.0 Å. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt% water.

公开(公告)号：EP2406341A2

公开(公告)日：2012-01-18

申请号：EP10751523.1

申请日：2010-03-12

申请人： Saint-Gobain Ceramics & Plastics, Inc.

发明人： WANG, Jun ,  LACONTO, Ronald ,  HAERLE, Andrew

IPC分类号： C09K3/14

CPC分类号： H01L21/30625 ,  B24B37/00 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/02024 ,  H01L29/1608

摘要： A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 Å/min to achieve a Ra of not greater than about 5.0 Å. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt% water.

公开(公告)号：EP2260013A2

公开(公告)日：2010-12-15

申请号：EP09710429.3

申请日：2009-02-05

申请人： Saint-Gobain Ceramics & Plastics, Inc.

发明人： HAERLE, Andrew, G. ,  WANG, Jun

IPC分类号： C04B35/50 ,  H01L21/30 ,  C01F17/00 ,  C09G1/02

CPC分类号： C01F17/0043 ,  B82Y30/00 ,  C01P2004/03 ,  C01P2004/50 ,  C01P2004/54 ,  C01P2004/64 ,  C01P2006/10 ,  C01P2006/12 ,  C09K3/1409 ,  C09K3/1463

摘要： A particulate material comprising cerium oxide particles having a secondary particle size distribution in a range of 80 nm to 199 nm and a density of at least 6.6 g/cm3.