摘要:
A display module 110 includes a backlight 20 which effectively dissipates heat generated at light emitting diodes, LEDs 23, and heat dissipation units 80 to effectively dissipate heat generated at driver chips 75, which can prevent movement of the driver chips by attaching porous fillers to the heat dissipation units. The backlight 20 disposed on a rear side of the display panel 10 includes a plurality of printed circuit boards 21, a bottom chassis 50 adapted to accommodate the backlight unit and provided with a plurality of seating grooves 51a, and a driving printed circuit board 21.
摘要:
A display module 110 includes a backlight 20 which effectively dissipates heat generated at light emitting diodes, LEDs 23, and heat dissipation units 80 to effectively dissipate heat generated at driver chips 75, which can prevent movement of the driver chips by attaching porous fillers to the heat dissipation units. The backlight 20 disposed on a rear side of the display panel 10 includes a plurality of printed circuit boards 21, a bottom chassis 50 adapted to accommodate the backlight unit and provided with a plurality of seating grooves 51a, and a driving printed circuit board 21.