ELECTRONIC DEVICE COMPRISING MODULE ASSEMBLY

    公开(公告)号:EP4289346A1

    公开(公告)日:2023-12-13

    申请号:EP22781432.4

    申请日:2022-03-14

    摘要: An electronic device is provided. The electronic device includes a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.