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公开(公告)号：EP4372815A1
公开(公告)日：2024-05-22
申请号：EP23187583.2
申请日：2023-07-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： PARK, Joonyong , KIM, Dongkyun , KIM, Dongho , HWANG, Kyungwook , HWANG, Junsik
CPC classification number: H01L27/156 , H01L25/0753 , H01L33/38 , H01L33/0095 , H01L33/0093 , H01L25/167 , H01L33/44 , H01L33/46
Abstract: Provided are a multifold micro emitting device, a display apparatus, a method of manufacturing the multifold micro emitting device, and method of manufacturing the display apparatus. The multifold micro light emitting device includes a plurality of sub light emitting devices, a first electrode configured to apply a voltage to each of the plurality of sub light emitting devices, a second electrode configured to apply a common voltage to the plurality of sub light emitting devices, and a separator configured to separate the plurality of sub light emitting devices from each other, and the plurality of sub light emitting devices are configured as a single chip.
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公开(公告)号：EP4071836A1
公开(公告)日：2022-10-12
申请号：EP22733286.3
申请日：2022-01-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： HWANG, Junsik , HONG, Seogwoo , HWANG, Kyungwook , KIM, Hyunjoon , PARK, Joonyong
IPC: H01L33/00 , H01L25/075 , H01L27/15
Abstract: According to an aspect of an embodiment, provided is a micro semiconductor chip transferring substrate including: a mold including a plurality of recesses formed to be recessed in a certain depth from an upper surface; and a surface energy reduction pattern formed in region between the plurality of recesses, on the upper surface, the surface energy reduction pattern including a plurality of uneven patterns. When the micro semiconductor chips are aligned by a wet alignment method, by such surface energy reduction pattern, sliding of the micro semiconductor chips toward the inside of the recesses may be improved.
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公开(公告)号：EP3965171A1
公开(公告)日：2022-03-09
申请号：EP21184076.4
申请日：2021-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： HWANG, Kyungwook , HWANG, Junsik , HONG, Seogwoo
IPC: H01L33/14 , H01L33/04 , H01L33/18 , H01L33/20 , H01L33/32 , H01L25/075 , H01L33/00 , H01L33/08 , H01L33/44 , H01L25/16
Abstract: Provided is a micro light emitting device and a display apparatus having the micro light emitting device. The micro light emitting device (100) includes a first-type semiconductor layer (120) provided on a substrate (110), a superlattice layer (130) provided on the first-type semiconductor layer, a current blocking layer (140) provided on a side portion of the superlattice layer, an active layer (150) provided on the superlattice layer and the current blocking layer, and a second-type semiconductor layer (160) provided on the active layer.
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公开(公告)号：EP4492456A2
公开(公告)日：2025-01-15
申请号：EP24178759.7
申请日：2024-05-29
Inventor： OH, Youngtek , YOO, Geonwook , HWANG, Kyungwook , PARK, Changkun , SONG, Sanghoon , YEOM, Minjae , LEE, Gyuhyung , HWANG, Junsik
IPC: H01L23/482 , H01L29/423 , H01L29/66 , H01L29/778
Abstract: A semiconductor device includes a channel layer including a first group III-V semiconductor material; a barrier layer provided on an upper surface of the channel layer, the barrier layer including a second group III-V semiconductor material that is different than the first group III-V semiconductor material; a plurality of sources/drains spaced apart from each other on an upper surface of the barrier layer; a gate insulating layer covering the upper surface of the barrier layer and upper surfaces of the plurality of sources/drains; a gate provided on an upper surface of the gate insulating layer, the gate not overlapping the plurality of sources/drains; a plurality of source/drain electrodes electrically connected to corresponding sources/drains among the plurality of sources/drains; and a gate electrode electrically connected to the gate, wherein the plurality of source/drain electrodes has a diagonally symmetrical arrangement.
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公开(公告)号：EP4303938A1
公开(公告)日：2024-01-10
申请号：EP23155615.0
申请日：2023-02-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： KIM, Hyunjoon , HWANG, Kyungwook , KIM, Dongkyun , KIM, Dongho , PARK, Joonyong , YU, Minchul , HONG, Seogwoo , HWANG, Junsik
Abstract: A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first chip alignment module configured to align the large amount of micro-semiconductor chips in a plurality of grooves, a second chip supply module configured to supply a small amount of micro-semiconductor chips, and a second chip alignment module configured to align the small amount of micro-semiconductor chips.
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Patent Agency Ranking6.发明公开
公开(公告)号：EP4191690A1
公开(公告)日：2023-06-07
申请号：EP22207822.2
申请日：2022-11-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： KIM, Dongho , HWANG, Kyungwook , PARK, Joonyong , HWANG, Junsik
IPC: H01L33/50 , H01L25/075 , H01L33/32
Abstract: Provided is a micro light emitting semiconductor device (100) including a first semiconductor layer (110), a light emitting layer (115) provided on the first semiconductor layer (110), a second semiconductor layer (120) provided on the light emitting layer (115), and a color conversion layer (130) provided on the second semiconductor layer (120), the color conversion layer (130) including a porous layer (131) that includes quantum dots, (132) wherein a doping type of the second semiconductor layer (120) is different from a doping type of the color conversion layer (130).
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公开(公告)号：EP4180124A2
公开(公告)日：2023-05-17
申请号：EP22174218.2
申请日：2022-05-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： KIM, Dongkyun , KIM, Hyunjoon , PARK, Joonyong , HONG, Seogwoo , HWANG, Kyungwook
Abstract: A chip transfer apparatus includes: a chip storage module (310) in which a plurality of micro-semiconductor chips (110) and a suspension including impurities (120) are stored; a chip filtration module (320) separating a first suspension including the plurality of micro-semiconductor chips (110) and a second suspension including the impurities (120) in the suspension; and a chip supply module (330) configured to supply the first suspension onto the transfer substrate (200) such that the first suspension is introduced from the chip filtration module (320) and the plurality of micro-semiconductor chips (110) are flowable on the transfer substrate (200).
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公开(公告)号：EP4170736A1
公开(公告)日：2023-04-26
申请号：EP22169950.7
申请日：2022-04-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： KIM, Hyunjoon , HONG, Seogwoo , HWANG, Kyungwook , KIM, Dongkyun , PARK, Joonyong , HWANG, Junsik
IPC: H01L33/62 , H01L33/54 , H01L33/20 , H01L25/075
Abstract: A light-emitting device and a display apparatus including the light-emitting device are provided. The light-emitting device includes a light-emitting cell including first and second electrodes arranged on an upper surface to be apart from each other, an extended layer in which the light-emitting cell is embedded and which has a width greater than a width of the light-emitting cell, and first and second electrode pads arranged on an upper surface of the extended layer to be apart from each other and respectively electrically connected to the first and second electrode.
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9.发明公开
公开(公告)号：EP4170703A1
公开(公告)日：2023-04-26
申请号：EP22201314.6
申请日：2022-10-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： HWANG, Kyungwook , HWANG, Junsik , KIM, DONGKYUN , KIM, Dongho , KIM, Hyunjoon , PARK, Joonyong , HONG, Seogwoo
IPC: H01L21/673 , H01L21/683 , H01L23/00
Abstract: Provided is a micro semiconductor chip transfer substrate including a base substrate, guide rails provided on the base substrate extending in a direction parallel to each other and spaced apart from each other, and a plurality of grooves provided in the base substrate between the guide rails and configured to accommodate micro semiconductor chips.
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公开(公告)号：EP4084094A1
公开(公告)日：2022-11-02
申请号：EP22150446.7
申请日：2022-01-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： HWANG, Junsik , HWANG, Kyungwook , KIM, Dongho , KIM, Hyunjoon , PARK, Joonyong , HONG, Seogwoo
IPC: H01L33/00
Abstract: A multi-use transfer mold and a method of manufacturing a display apparatus are provided. The multi-use transfer mold includes a transfer substrate and a plurality of grooves provided in the transfer substrate, wherein each of the grooves includes a transfer area for accommodating a transfer micro-light-emitting device and a preliminary area for accommodating a preliminary micro-light-emitting device, wherein the preliminary area is connected to the transfer area.
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