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公开(公告)号：EP4321963A1
公开(公告)日：2024-02-14
申请号：EP22804831.0
申请日：2022-04-04
发明人： HEO, Jihun , KIM, Hyunwoo , PARK, Jihoon , HWANG, Seungho
摘要： A foldable electronic device according to various embodiments of the disclosure may include: a hinge module coupled at least in part between a first support member and a second support member; a first housing coupled at least in part to a first side of the hinge module by using the first support member; a second housing that is coupled at least in part to a second side of the hinge module by using the second support member and is configured to be unfolded and folded with the first housing by using the hinge module; a flexible display including a first display disposed on a first surface of the first housing, and a second display disposed on a third surface of the second housing; a sensor mounting module disposed in the first housing and the second housing across the inside of the hinge module; a first fingerprint sensor that is mounted on a first surface of the sensor mounting module and is disposed between the third surface of the second housing and the second display; and a second fingerprint sensor that is mounted on a second surface of the sensor mounting module and is disposed on a fourth surface of the second housing. Various other embodiments are possible.
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公开(公告)号：EP4318139A1
公开(公告)日：2024-02-07
申请号：EP22833392.8
申请日：2022-05-10
发明人： PARK, Jihoon , KIM, Hyunwoo , HEO, Jihun , HWANG, Seungho
摘要： According to various embodiments of the present disclosure, an electronic device may comprise: a housing; a protrusion part which protrudes from a side of the housing, and which includes a first window and a second window; a first substrate arranged inside the housing; a second substrate connected to one surface of the first substrate; a first sensor circuit which is arranged on a first surface of the second substrate, and which is arranged to be spaced apart from the bottom of the first window inside the protrusion part; and a second sensor circuit which is arranged on a second surface of the second substrate, opposite to the first surface of the second substrate, and which is arranged to be spaced apart from the top of the second window inside the protrusion part. Various embodiments other than the various embodiments disclosed in the present document are possible.
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公开(公告)号：EP4332720A1
公开(公告)日：2024-03-06
申请号：EP22842263.0
申请日：2022-05-13
发明人： HEO, Jihun , KIM, Hyunwoo , PARK, Jihoon , HWANG, Seungho
摘要： Various embodiments of the disclosure relate to an electronic device including a fingerprint sensor. The electronic device includes a housing including a side member forming at least a portion of an exterior, a support member disposed inside the housing, a first hole formed in the support member, a first fingerprint sensor disposed in the first hole, and a non-conductive injection molding material integrally joining the support member and the first fingerprint sensor. The support member and the first fingerprint sensor are integrally joined through an insert injection molding. In addition, various other embodiments are possible.
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公开(公告)号：EP3894985A1
公开(公告)日：2021-10-20
申请号：EP20801936.4
申请日：2020-05-07
发明人： HEO, Jihun , PARK, Jihoon , HWANG, Seungho , RHEE, Bongjae , KIM, Dongchurl , KIM, Hyunwoo , HAN, Sanggeun
IPC分类号： G06F1/16
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