公开(公告)号：EP4203181A1

公开(公告)日：2023-06-28

申请号：EP21898456.5

申请日：2021-11-15

申请人： Samsung Electronics Co., Ltd.

发明人： LEE, Gunwoo ,  LEE, Soogyu ,  JUN, Sungsoo ,  KIM, Ryounghun ,  KIM, Sanghyeon

IPC分类号： H01Q1/24 ,  H01Q1/22

摘要： An electronic device according to an embodiment includes: a housing including a frame, a first temple connected to one side of the frame, and a second temple connected to the other side of the frame, a first printed circuit board (PCB) positioned in the first temple, and a flexible printed circuit board electrically connected to the first PCB, and the flexible printed circuit board includes a first rigid portion connected to the first PCB, a first flexible portion extending from the first rigid portion in a first direction, and a second flexible portion extending from the first rigid portion in a second direction different from the first direction, the second flexible portion being bent in a first bending area to overlap at least a portion of the first flexible portion.