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    SPEAKER MODULE STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
    1.
    发明公开
    SPEAKER MODULE STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：EP4194997A1

    公开(公告)日：2023-06-14

    申请号：EP22739663.7

    申请日：2022-01-12

    申请人： Samsung Electronics Co., Ltd.

    发明人： PARK, Youngbae ,  LEE, Myungcheol ,  KIM, Kiwon ,  KIM, Taeeon ,  YOON, Changshik ,  CHO, Joonrae

    IPC分类号： G06F1/16 ,  H04R1/28

    摘要： A speaker module structure according to various embodiments may include a first structure, a second structure configured to couple to the first structure, and a speaker coupled to at least one of the first structure or the second structure, wherein the second structure comprises at least one groove configured to form a resonance space by coupling between the first structure and the second structure, the resonance space is connected to the speaker and has an adsorption material injected therein, and when the first structure and the second structure are coupled, one end of the groove comprises an opening formed in a closed loop comprising a part of the first structure and a part of the second structure.