ELECTRONIC DEVICE AND ELECTRONIC DEVICE HOUSING STRUCTURE

    公开(公告)号:EP4199663A1

    公开(公告)日:2023-06-21

    申请号:EP21862166.2

    申请日:2021-08-31

    摘要: Various embodiments disclosed in the present document relate to an electronic device and, specifically, to an electronic device including a housing formed through an anodizing process, and to an electronic device housing structure. According to one embodiment disclosed in the present document, an electronic device may be provided, the electronic device including a housing comprising: a front plate; a rear plate facing away from the front plate; a side member surrounding a space between the front plate and the rear plate; and a support member which is disposed in the space, wherein a substantial part of the housing is formed of an electrically conductive material, the substantial part is separated into a first portion and a second portion which is electrically isolated from the first portion, the first portion is colored with a first color, and the second portion is colored with a second color different from the first color. Various other embodiments may be employed.