ELECTRONIC DEVICE COMPRISING BUFFER STRUCTURE

    公开(公告)号:EP4451654A1

    公开(公告)日:2024-10-23

    申请号:EP23752997.9

    申请日:2023-01-04

    IPC分类号: H04M1/02 H05K1/14 H05K5/00

    摘要: An electronic device may comprise: a first printed circuit board; a second printed circuit board; a flexible printed circuit board connected to each of the first printed circuit board and the second printed circuit board and extending between the first printed circuit board and the second printed circuit board; and a shock absorber configured to buffer the flexible printed circuit board.

    ELECTRONIC DEVICE COMPRISING MULTI-FUNCTIONAL MEMBERS

    公开(公告)号:EP4395287A1

    公开(公告)日:2024-07-03

    申请号:EP23748934.9

    申请日:2023-07-12

    IPC分类号: H04M1/02 H05K5/02 H05K9/00

    摘要: According to an embodiment of the disclosure, an electronic device may be provided comprising: a housing; a bracket disposed inside the housing and comprising a plurality of through holes including a first through hole and a second through hole; a first conductive pattern disposed on the bracket; a second conductive pattern disposed on the bracket; and a plurality of multi-functional members at least partially visually exposed to an outside of the housing, wherein a first multi-functional member among the multi-functional members is disposed around the first through hole and is electrically connected to the first conductive pattern and the second conductive pattern, and wherein a second multi-functional member among the multi-functional members is disposed around the second through hole, is electrically connected to the second conductive pattern, and is not electrically connected to the first conductive pattern except via the first multi-functional member and/or at least one other multi-functional member among the multi-functional members. Other various embodiments are possible.