公开(公告)号：EP4024833A1

公开(公告)日：2022-07-06

申请号：EP21753232.4

申请日：2021-02-08

申请人： Samsung Electronics Co., Ltd.

发明人： JUN, Sungsoo ,  PARK, Changho ,  YANG, Jaeyoung ,  KIM, Daekwang ,  CHUN, Sooung ,  KIM, Youngkyu ,  WEE, Jongchun ,  CHOI, Hwanseok ,  CHOI, Jongchul

IPC分类号： H04M1/02 ,  H05K5/06 ,  H04R1/08

摘要： According to various embodiments of the disclosure, an electronic device includes a housing, a camera decoration member having at least a portion disposed inside the housing and a first through-hole formed therein to be at least partially fluidly connected with the outside of the housing, the camera decoration member being configured to support at least a portion of a camera module disposed inside the housing, a microphone module including a first printed circuit board (PCB) disposed on the camera decoration member and a microphone disposed on the first PCB, an adhesive member that is disposed between the first PCB and the camera decoration member and that has a second through-hole, at least a portion of which is fluidly connected with the first through-hole, and a waterproof membrane disposed in the second through-hole so as to be located between the camera decoration member and the first PCB to cover the first through-hole. Besides, it may be permissible to prepare various other embodiments speculated through the specification.