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公开(公告)号:EP2548072A1
公开(公告)日:2013-01-23
申请号:EP11711057.7
申请日:2011-03-14
IPC分类号: G02B26/02
CPC分类号: G02B26/005
摘要: The present invention relates to a method for making a support plate for an electrowetting device. The method comprises the steps of: providing the support plate with a hydrophobic layer; arranging a pattern of hydrophilic material on the hydrophobic layer; and removing a surface layer of the hydrophobic layer by a solvent. The present invention further relates to an electrowetting device including a support plate that comprises a hydrophobic layer having a thickness, and a pattern of hydrophilic material arranged on a first area of the hydrophobic layer, the thickness of the hydrophobic layer being larger within the first area than outside the first area.