专利检索 ap:("SanDisk Technologies LLC") AND inv:"OTOI, Hisakazu" 第 1 页

1.

发明公开
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BONDED CHIP ASSEMBLY WITH THROUGH-SUBSTRATE VIA STRUCTURES AND METHOD OF MAKING THE SAME 审中-公开

公开(公告)号：EP3669398A1

公开(公告)日：2020-06-24

申请号：EP18910814.5

申请日：2018-11-20

申请人： SanDisk Technologies LLC

发明人： MUSHIGA, Mitsuteru , NISHIDA, Akio , SUGIURA, Kenji , OTOI, Hisakazu , NISHIKAWA, Masatoshi

IPC分类号： H01L27/11551 , H01L27/11524 , H01L27/11578 , H01L27/1157 , H01L23/00 , H01L23/522