-
公开(公告)号：EP4000771A1
公开(公告)日：2022-05-25
申请号：EP20208094.1
申请日：2020-11-17
IPC分类号： B22F10/20 , B22F10/40 , B22F12/00 , B29C64/153 , B29C64/245 , B29C64/40 , B33Y10/00 , B33Y30/00
摘要： Disclosed is a method for manufacturing an article (230) requiring support (235) on top of a base device (220) using an additive manufacturing process in an additive manufacturing device, wherein the additive manufacturing device comprises a build plate (200). The build plate (200) comprises a receptacle (210) for receiving the base device (220) and an insert (240), provided in proximity to each base device, the insert being adapted for having a support (250) for the article manufactured thereon. The method comprises the step of manufacturing (302) the article on top of the base device, and manufacturing (306) the support (250) for the article (230) on top of the insert (240).
-
公开(公告)号：EP4341023A1
公开(公告)日：2024-03-27
申请号：EP22730386.4
申请日：2022-05-18
IPC分类号： B22F7/08 , B22F10/14 , B22F10/28 , B22F10/31 , B22F12/30 , B22F12/90 , B29C64/182 , B29C64/245 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02
-
公开(公告)号：EP4000772A1
公开(公告)日：2022-05-25
申请号：EP20208100.6
申请日：2020-11-17
IPC分类号： B22F10/20 , B22F10/40 , B22F12/00 , B29C64/153 , B29C64/245 , B33Y10/00 , B33Y30/00
摘要： Disclosed is a method for manufacturing an article (230) on top of a base device (220) with an additive manufacturing device using an additive manufacturing process, wherein the additive manufacturing device comprises a build plate (200). The method comprises positioning (302) the base device (220) on the build plate (200) and providing (304) a cover layer (240) on the build plate (200), wherein the cover layer (240) comprises a recess for the base device (220). The method further comprises manufacturing (306) the article on top of the base device (220).
-
4.发明公开
公开(公告)号：EP4326464A1
公开(公告)日：2024-02-28
申请号：EP22724693.1
申请日：2022-04-21
-
-
-
搜索结果
4 条记录 (耗时 0.009 秒)
