公开(公告)号：EP4410477A1

公开(公告)日：2024-08-07

申请号：EP22876426.2

申请日：2022-09-29

申请人： Sanoh Industrial Co., Ltd. ,  National University Corporation Nagaoka University of Technology ,  Hitechnoth Corporation

发明人： AIDA Hideo ,  KATAKURA Haruji ,  OMIYA Natsuko ,  KOBORI Yasuyuki

IPC分类号： B24B37/005 ,  B24B37/00 ,  B24B37/30 ,  H01L21/304

CPC分类号： B24B37/005 ,  B24B37/00 ,  H01L21/304 ,  B24B37/30

摘要： A polishing device includes a wafer holder (31) that holds a wafer (W) and that brings the held wafer (W) into contact with a polishing surface (22a); a polishing plate driver (24) or a head driver (34) that, when polishing the wafer (W), relatively rotates the wafer holder (31) with respect to the polishing surface (22a) to which a slurry (SL) is supplied; a polishing pressure applier (32) that applies polishing pressure to the wafer (W) by pressing the wafer (W) against the polishing surface (22a) via the wafer holder (31); and a controller (50) that, during polishing of the wafer (W), cyclically switches a state of the polishing pressure applied to the wafer (W) via the polishing pressure applier (32) between a high pressure state and a low pressure state in which the polishing pressure is lower than in the high pressure state.