AIRFLOW GUIDE
    1.
    发明公开
    AIRFLOW GUIDE 审中-公开

    公开(公告)号:EP4358666A1

    公开(公告)日:2024-04-24

    申请号:EP23203117.9

    申请日:2023-10-12

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20145 H05K7/20727

    摘要: An airflow guide (30a) includes at least one first channel configured to direct a portion of air from a first fan (14a) in a first direction (A) to a second power component (20b) and at least one second channel configured to direct a portion of air from a second fan (14b) in a second direction (B) to a first power component (20a). The airflow guide further includes a first body portion having the at least one first channel and the at least one second channel. The at least one first channel may include several channels each configured to direct the portion of air in the first direction to the second power component and the at least one second channel may include several channels each configured to direct the portion of air in the second direction to the first power component.

    SYSTEMS AND METHODS FOR ARC FLASH INCIDENT ENERGY REDUCTION

    公开(公告)号:EP4030877A1

    公开(公告)日:2022-07-20

    申请号:EP22151482.1

    申请日:2022-01-14

    IPC分类号: H05K7/14 H05K5/02

    摘要: An assembly to contain energy from arc flash within a mounting slot of an equipment rack includes a valve panel assembly including a first valve panel body secured to the frame members by a first hinge and a second valve panel body secured to the frame members by a second hinge. The first valve panel body and the second valve panel body are configured to rotate between closed positions and open positions. A method of assembling a system to contain energy from arc flash within a mounting slot of an equipment rack is further disclosed.

    LIQUID COOLING MANIFOLDS, COOLING SYSTEMS, SERVICE MODULES AND METHODS OF COOLING

    公开(公告)号:EP4432800A2

    公开(公告)日:2024-09-18

    申请号:EP24162495.6

    申请日:2024-03-08

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20272 H05K7/20781

    摘要: A liquid cooling manifold includes a manifold body having an inlet flow channel, an outlet flow channel and an expansion channel. The liquid cooling manifold further includes a plurality of distribution inlet connectors coupled to the manifold body and in fluid communication with the inlet flow channel. The liquid cooling manifold further includes a plurality of distribution outlet connectors coupled to the manifold body and in fluid communication with the outlet flow channel. The liquid cooling manifold further includes a heat exchanger coupled to the manifold body.

    SYSTEM FOR INSULATING HIGH CURRENT BUSBARS
    4.
    发明公开
    SYSTEM FOR INSULATING HIGH CURRENT BUSBARS 审中-公开
    用于绝缘高电流母线的系统

    公开(公告)号:EP3078032A1

    公开(公告)日:2016-10-12

    申请号:EP13898604.7

    申请日:2013-12-03

    IPC分类号: H01B5/02 H02B1/20

    摘要: A method of treating a surface of an aluminum busbar includes pre-conditioning the surface of the busbar, anodizing one portion of the surface of the busbar, and plating another portion of the surface of the busbar with at least one metal. A fixture used to secure a busbar for a treatment process is also disclosed.

    摘要翻译: 处理铝母线表面的方法包括预处理母线表面,阳极氧化母线表面的一部分,以及用至少一种金属电镀母线表面的另一部分。 还披露了用于固定母线以进行处理过程的夹具。

    POWER SEMICONDUCTOR HEATSINK
    5.
    发明授权
    POWER SEMICONDUCTOR HEATSINK 有权
    功率半导体HEATSINK

    公开(公告)号:EP2430655B1

    公开(公告)日:2018-02-21

    申请号:EP10719980.4

    申请日:2010-05-14

    IPC分类号: H01L23/40

    摘要: A heatsink includes a thermally conductive body including a plurality of fins configured to conduct and dissipate heat. The body is configured to receive a circuit board containing heat-producing electrical components along a width of the body. The heatsink further includes a pivot mechanism pivotally coupled to the body and configured and disposed to contact the heat-producing electrical components. The heatsink further includes a bias device connected to the body and the pivot mechanism and configured to change from a first state to a second state to cause the pivot mechanism to rotate relative to the body to move a contact portion of the pivot mechanism toward the body. The heatsink is configured to receive the heat-producing electrical components between the contact portion of the pivot mechanism and the body, and the bias device is configured to bias the contact portion of the pivot mechanism to urge the heat-producing electrical components against the body when the bias device is in the second state.

    DOUBLE CHOKE CONSTRUCTION FOR LIQUID-COOLED POWER MODULE

    公开(公告)号:EP4350722A1

    公开(公告)日:2024-04-10

    申请号:EP23200334.3

    申请日:2023-09-28

    IPC分类号: H01F27/22

    摘要: A multi-transformer assembly includes a first transformer having a first core and a first set of windings, a second transformer having a second core and a second set of windings, and a heatsink positioned between the first core and the second core. The heatsink includes a first side and a second side. The first side of the heatsink is opposite the second side of the heatsink, and thermally coupled to the first core and the first set of windings. The first side is thermally coupled to the first core and the first set of windings by a first thermal conductor. The second side is thermally coupled to the second core and the second set of windings. The second side is thermally coupled to the second core and the second set of windings by a second thermal conductor.