公开(公告)号：EP4415389A3

公开(公告)日：2024-11-20

申请号：EP24185857.0

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R1/10 ,  H04R9/06 ,  H04R9/04 ,  H04R9/02 ,  H04R5/033 ,  H04R5/027 ,  H04R1/28

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：EP4401425A1

公开(公告)日：2024-07-17

申请号：EP22952310.5

申请日：2022-07-27

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： CUI, Chaojie ,  ZHU, Guangyuan

IPC: H04R17/02 ,  H04R9/02

CPC classification number: B06B1/0603 ,  H10N30/2041 ,  G10K9/121 ,  H04R17/00 ,  H10N30/2042 ,  H04R17/005

Abstract: The present disclosure provides an acoustic output apparatus, comprising: a vibration element, the vibration element including a beam structure extending in a length direction, and the beam structure including: a piezoelectric layer configured to deform in response to an electrical signal, the deformation driving the vibration element to vibrate; and a mass element, the mass element being connected to a first position of the beam structure, the vibration of the vibration element driving the mass element to vibrate in a direction perpendicular to the length direction, wherein a ratio between a distance from the first position to one end of the beam structure and a length of the beam structure is in a range from 0.3 to 0.95 along the length direction of the beam structure.

公开(公告)号：EP4373137A1

公开(公告)日：2024-05-22

申请号：EP22882569.1

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R9/06

CPC classification number: H04R9/06 ,  H04R1/10

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：EP4415386A3

公开(公告)日：2024-11-06

申请号：EP24185840.6

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R1/28 ,  H04R1/10 ,  H04R9/06 ,  H04R9/04 ,  H04R9/02 ,  H04R5/033 ,  H04R5/027

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：EP4415388A2

公开(公告)日：2024-08-14

申请号：EP24185854.7

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R9/06

CPC classification number: H04R9/06 ,  H04R2460/1320130101 ,  H04R1/105 ,  H04R1/1008 ,  H04R1/1058 ,  H04R1/1075 ,  H04R1/2811 ,  H04R5/0335 ,  H04R5/027 ,  H04R9/025 ,  H04R9/045 ,  H04R9/046 ,  H04R2201/10520130101 ,  H04R2400/1120130101

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：EP4415387A2

公开(公告)日：2024-08-14

申请号：EP24185847.1

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R9/06

CPC classification number: H04R9/06 ,  H04R2460/1320130101 ,  H04R1/105 ,  H04R1/1008 ,  H04R1/1058 ,  H04R1/1075 ,  H04R1/2811 ,  H04R5/0335 ,  H04R5/027 ,  H04R9/025 ,  H04R9/045 ,  H04R9/046 ,  H04R2201/10520130101 ,  H04R2400/1120130101

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：EP4415386A2

公开(公告)日：2024-08-14

申请号：EP24185840.6

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R9/06

CPC classification number: H04R9/06 ,  H04R2460/1320130101 ,  H04R1/105 ,  H04R1/1008 ,  H04R1/1058 ,  H04R1/1075 ,  H04R1/2811 ,  H04R5/0335 ,  H04R5/027 ,  H04R9/025 ,  H04R9/045 ,  H04R9/046 ,  H04R2201/10520130101 ,  H04R2400/1120130101

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：EP4373130A1

公开(公告)日：2024-05-22

申请号：EP22882570.9

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R1/10

CPC classification number: H04R9/06 ,  H04R1/10

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：EP4415388A3

公开(公告)日：2024-11-13

申请号：EP24185854.7

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R1/10 ,  H04R9/06 ,  H04R9/04 ,  H04R9/02 ,  H04R5/033 ,  H04R5/027 ,  H04R1/28

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：EP4415387A3

公开(公告)日：2024-11-13

申请号：EP24185847.1

申请日：2022-09-22

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： FU, Junjiang ,  WANG, Yueqiang ,  CUI, Chaojie ,  ZHONG, Lei ,  CAI, Zhi ,  ZHANG, Yingying ,  ZHOU, Weihua ,  CHENG, Piyou

IPC: H04R1/10 ,  H04R9/06 ,  H04R5/033 ,  H04R5/027 ,  H04R1/28 ,  H04R9/04 ,  H04R9/02

Abstract: The present disclosure mainly relates to a headphone. The headphone includes a supporting assembly and a core module connected with the supporting assembly. The supporting assembly is configured to support the core module to be worn at a wearing position. The core module includes a core housing, a transducer device, and a vibration panel. The transducer device is provided in an accommodating cavity of the core housing, and the vibration panel is connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.