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公开(公告)号：EP1850376A3
公开(公告)日：2010-01-13
申请号：EP07251772.5
申请日：2007-04-27
发明人： Nakano, Akio, c/o Silicone-Electronics Materials , Handa, Ryuichi, c/o Silicone-Electronics Materials , Sakurai, Ikuo, c/o Silicone-Electronics Materials
IPC分类号： H01L21/683 , B23B5/16
CPC分类号： H01L21/6833 , B32B9/005 , B32B15/08 , B32B15/20 , B32B25/02 , B32B25/08 , B32B25/20 , B32B27/06 , B32B27/281 , B32B27/36 , B32B2264/102 , B32B2264/108 , B32B2307/206 , B32B2307/306 , B32B2307/3065 , B32B2307/54 , B32B2457/08 , B32B2457/14
摘要： An electrostatic chuck comprises an insulating layer with an electrode embedded therein and having a surface to come in contact with a workpiece to be held. Formed on the insulating layer surface is a silicone rubber layer which is filled with reinforcing silica, but free of another filler having an average particle size of at least 0.5 µm. The ESC allows for an intimate contact with a wafer and has an improved cooling capacity.
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公开(公告)号：EP1850376A2
公开(公告)日：2007-10-31
申请号：EP07251772.5
申请日：2007-04-27
发明人： Nakano, Akio, c/o Silicone-Electronics Materials , Handa, Ryuichi, c/o Silicone-Electronics Materials , Sakurai, Ikuo, c/o Silicone-Electronics Materials
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , B32B9/005 , B32B15/08 , B32B15/20 , B32B25/02 , B32B25/08 , B32B25/20 , B32B27/06 , B32B27/281 , B32B27/36 , B32B2264/102 , B32B2264/108 , B32B2307/206 , B32B2307/306 , B32B2307/3065 , B32B2307/54 , B32B2457/08 , B32B2457/14
摘要： An electrostatic chuck comprises an insulating layer with an electrode embedded therein and having a surface to come in contact with a workpiece to be held. Formed on the insulating layer surface is a silicone rubber layer which is filled with reinforcing silica, but free of another filler having an average particle size of at least 0.5 µm. The ESC allows for an intimate contact with a wafer and has an improved cooling capacity.
摘要翻译： 静电卡盘包括具有嵌入其中的电极的绝缘层，并且具有与待保持的工件接触的表面。 在绝缘层表面上形成硅橡胶层，其填充有增强二氧化硅，但不含平均粒度为至少0.5μm的另一种填料。 ESC允许与晶片紧密接触并具有改善的冷却能力。
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