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    Method and apparatus for controlling shot peening device
    1.
    发明公开
    Method and apparatus for controlling shot peening device 有权
    用于控制喷丸处理装置的方法和设备

    公开(公告)号：EP1254744A2

    公开(公告)日：2002-11-06

    申请号：EP02009235.9

    申请日：2002-04-25

    申请人： Sintokogio, Ltd.

    发明人： Yamamoto, Masatoshi, Sintokogio, Ltd. ,  Kaga, Hideaki, Sintokogio, Ltd.

    IPC分类号： B24C1/10

    CPC分类号： B24C1/10 ,  Y10T29/479

    摘要： A system for shot peening is disclosed. The system includes an enclosure 12 in which are provided a workpiece W to be shot peened and a nozzle 16 for projecting the shot particles. A memory stores data for maximizing the anticipated shot-peening intensity at the workpiece based on the predetermined conditions of the shot peening. Then a calculating circuitry determines the conditions of the shot peening to be carried out in the system to maximize an anticipated shot-peening intensity at the workpiece based on the stored data from the memory and the selected type of the shot-peening process to be applied to the workpiece before the shot particles have been actually projected. The nozzle 16 is then actuated under the determined conditions such that it projects the shot particles and directs them onto the workpiece. The shot-peening intensity of the actually projected shot particles at the workpiece is measured by a measuring device 18. Then a calibration circuitry controls the mass-flow rate of the shot particles and the pressure or the flow rate of the compressed air to maximize the measured shot-peening intensity based on the stored data such that the nozzle 16 projects the shot particles under the corrected and controlled conditions.