公开(公告)号：EP3786662A1

公开(公告)日：2021-03-03

申请号：EP19793447.4

申请日：2019-02-28

申请人： Sony Corporation ,  Sony Semiconductor Solutions Corporation

发明人： OYAMA, Yusuke ,  KIKUCHI, Ken ,  OHTORII, Hiizu ,  OTANI, Eiji ,  MORITA, Hiroshi

IPC分类号： G01S7/481 ,  G01S17/93 ,  H01L31/12 ,  H01S5/022

摘要： The present disclosure relates to a ranging device and a ranging module that allow a light emitting element and a light receiving element to be integrated with a simple structure.
A light emitting substrate having a light emitting element is connected to a circuit substrate through first bumps, and a light receiving substrate having a single light emitting element or light emitting elements that are two-dimensionally disposed is connected to the circuit substrate through second bumps. The optical axis of a lens, the optical axis of the light emitting element, and the center axis of the light receiving element are disposed on substantially the same axis. The present technique can be applied to a ranging device that carries out ranging, and so forth.