公开(公告)号：EP4180982A1

公开(公告)日：2023-05-17

申请号：EP21836999.9

申请日：2021-06-25

申请人： Sony Semiconductor Solutions Corporation

发明人： TAKAHASHI Hiroo ,  NATSUKAWA Noriyuki ,  HIRAMA Takayuki ,  NARIYA Makoto

IPC分类号： G06F13/42 ,  G06F13/36 ,  G06F13/38

摘要： The present disclosure relates to a communication device, a communication method, and a program for offering adaptability to a wider variety of applications and enhancing reliability of communications.
With a CCI protocol implemented as an upper layer, a physical layer transmits and receives data including an extended header and an extended footer to and from another communication device. A CCI-FS processing section compares a Desination ID included in the extended header with an ID (Source ID) given to the communication device, and determines whether or not the data is for accessing the communication device. The physical layer is MIPI A-PHY that has an asymmetrical upper layer of a point-to-point topology and is designed to allow high-speed data transmission, control data, and electric power to share one physical wire. The present technology is applicable to a communication system that is used for connection in an in-vehicle camera, for example.