STRUCTURES FOR SUPPORTING THE FILLING OF WELLS IN MICROFLUIDIC DEVICES

    公开(公告)号:EP4056274A1

    公开(公告)日:2022-09-14

    申请号:EP22153573.5

    申请日:2022-01-27

    IPC分类号: B01L3/00

    摘要: The invention relates to structures for supporting the filling of wells, in particular in microfluidic devices and provides a microfluidic device, comprising a substrate with at least a first horizontal channel which continues as a first vertical chimney channel into a first well having a greater depth than the first horizontal channel with respect to an upper surface of the substrate, wherein the first vertical channel is half open to the volume of the first well. A method for filling a well of a microfluidic device using the device is also an object of the disclosure.