公开(公告)号：EP3225347A1

公开(公告)日：2017-10-04

申请号：EP17158115.0

申请日：2017-02-27

申请人： Subaru Corporation

发明人： NAKANO, Mayu ,  ADACHI, Takafumi

IPC分类号： B23K26/00 ,  B23K26/08 ,  C21D10/00 ,  B23K26/146

CPC分类号： B23K26/356 ,  B23K26/0069 ,  B23K26/009 ,  B23K26/0093 ,  B23K26/02 ,  B23K26/08 ,  B23K26/146 ,  C21D10/005

摘要： According to one embodiment, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

摘要翻译： 根据一个实施例，激光喷丸处理装置包括激光喷丸处理装置，该装置包括激光振荡器，喷嘴和倾斜结构。 激光振荡器发射激光。 喷嘴朝向待加工表面喷射液体并朝着待加工工件的表面照射激光。 倾斜结构使喷嘴和工件中的至少一个倾斜，以使液体的喷射方向不同于待处理表面的法线方向。 通过液体与待处理表面之间的碰撞和通过激光照射待处理表面中的至少一个而产生的气泡沿着与表面相对于喷射方向的倾斜方向 的液体。

公开(公告)号：EP3659739A1

公开(公告)日：2020-06-03

申请号：EP18838351.7

申请日：2018-04-04

申请人： Subaru Corporation

发明人： NAKANO, Mayu ,  ADACHI, Takafumi

IPC分类号： B23K26/356 ,  B23K26/00 ,  B23K26/16

摘要： According to one embodiment, a laser peening processing apparatus includes a laser oscillator and an irradiation system. The laser oscillator oscillates a laser light. The irradiation system condenses the laser light with a lens and irradiates a workpiece with the condensed laser light. The irradiation system is adapted to irradiate the workpiece with the laser light in a state where the workpiece has been exposed in an atmosphere without interposed liquid. Furthermore, according to one embodiment, a laser peening processing method includes producing a product or a semi-product by laser peening processing of the workpiece using the above-mentioned laser peening processing apparatus.

公开(公告)号：EP2161353B1

公开(公告)日：2019-07-24

申请号：EP09169799.5

申请日：2009-09-09

申请人： Subaru Corporation ,  Toshiba Energy Systems & Solutions Corporation

发明人： ADACHI, Takafumi ,  TAKEHISA, Hiroyuki ,  SANO, Yuji ,  CHIDA, Itaru

IPC分类号： C23C24/10 ,  B23K26/32 ,  B23K26/34 ,  B23K103/00 ,  C23C4/18 ,  C23C24/08 ,  C23C24/04 ,  C23C26/00