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1.发明公开THREE-DIMENSIONAL NET-LIKE ALUMINUM POROUS MATERIAL, ELECTRODE COMPRISING THE ALUMINUM POROUS MATERIAL, NON-AQUEOUS ELECTROLYTE BATTERY EQUIPPED WITH THE ELECTRODE, AND NON-AQUEOUS ELECTROLYTIC SOLUTION CAPACITOR EQUIPPED WITH THE ELECTRODE 审中-公开三维的，POWER-LIKE，多孔铝材料，铅从与LEAD的多孔铝材料EQUIPPED非水电解质电池及其与有冷凝器非水电解液EQUIPPED电极
公开(公告)号：EP2579364A1
公开(公告)日：2013-04-10
申请号：EP11789689.4
申请日：2011-05-26
发明人： OTA, Nobuhiro , HOSOE, Akihisa , MAJIMA, Masatoshi , NITTA, Koji , OTA, Hajime , OKUNO, Kazuki , KIMURA, Koutaro , GOTO, Kengo , NISHIMURA, Junichi
CPC分类号： H01M4/80 , C23C14/18 , C23C14/5846 , C23C24/087 , H01G9/048 , H01G9/058 , H01G9/145 , H01G11/06 , H01G11/50 , H01G11/56 , H01G11/66 , H01G11/70 , H01M4/131 , H01M4/661 , H01M4/70 , H01M4/74 , H01M4/747 , H01M4/808 , H01M2004/021 , Y02E60/13
摘要： Provided are a three-dimensional net-like aluminum porous body in which the diameter of cells in the porous body is uneven in the thickness direction of the porous body; a current collector and an electrode each using the aluminum porous body; and methods for producing these members. The porous body is a three-dimensional net-like aluminum porous body in a sheet form, for a current collector, in which the diameter of cells in the porous body is uneven in the thickness direction of the porous body. When a cross section in the thickness direction of the three-dimensional net-like aluminum porous body is divided into three regions of a region 1, a region 2 and a region 3 in this order, the average cell diameter of the regions 1 and 3 is preferably different from the cell diameter of the region 2.
摘要翻译： 本发明提供一种三维网状铝多孔体，其中细胞在多孔体中的直径是在多孔体的厚度方向上是不均匀; 集电体和在每个电极使用铝多孔体; 及其制造方法的论文成员。 多孔体为片状形式的三维网状铝多孔体，对于集电体，其中细胞在多孔体中的直径是在多孔体的厚度方向上不均匀。 当在三维网状铝多孔体的厚度方向上的截面被分割为区域1的三个区域，区域2和在该顺序的区域3，区域1和3的平均泡孔直径 优选来自该区域的小室直径不同。2
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2.发明公开WIRE FOR REED SWITCH, REED PIECE FOR REED SWITCH, AND REED SWITCH 审中-公开用于REED开关的电线，用于REED开关的簧片和REED开关
公开(公告)号：EP2873745A1
公开(公告)日：2015-05-20
申请号：EP13816309.2
申请日：2013-07-09
CPC分类号： H01H1/0201 , C22C19/07 , C22F1/10 , H01H1/66 , H01H36/0006 , H01H51/282 , Y10T428/12
摘要： A reed switch 10 includes a cylindrical glass tube 30 and a plurality of reeds 20 fixed to the glass tube 30 in a state where an end side including a contact point portion 22 of each of the reeds 20 is inserted in the glass tube 30. The reeds 20 are each produced by forming, by plastic working, a contact point portion 22 on an end side of a wire for a reed switch. The wire for a reed switch is composed of an iron-group alloy containing, by percent by mass, 1% or more and 10% or less of Fe, 10% or more and 35% or less of Ni, and the balance being Co and impurities and having a cubic crystal structure. The wire has a Curie temperature of 900°C or higher and a wire diameter of 1 mm or less. The wire is composed of a ternary alloy having a particular composition. Therefore, the wire has a high Curie temperature, a low resistance, and a particular structure and thus has good workability.
摘要翻译： 簧片开关10包括圆柱形玻璃管30和在包括每个簧片20的接触点部分22的端侧插入玻璃管30中的状态下固定到玻璃管30的多个簧片20。 每个簧片20都是通过塑性加工形成簧片开关导线端侧的接触点部分22而制成的。 用于簧片开关的导线由铁基合金构成，所述铁基合金以质量百分比计含有1％以上且10％以下的Fe，10％以上且35％以下的Ni，其余为Co 和杂质并具有立方晶体结构。 该线具有900℃或更高的居里温度和1mm或更小的线直径。 导线由具有特定组成的三元合金构成。 因此，该线具有高居里温度，低电阻和特定结构，因此具有良好的可加工性。
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3.发明授权SUBSTRATE, METHOD OF PRODUCING SUBSTRATE SUPERCONDUCTING WIRE AND METHOD OF PRODUCING OF SUPERCONDUCTING WIRE 有权基板，制造基板超导线材的方法以及制造超导线材的方法
公开(公告)号：EP2453447B1
公开(公告)日：2017-11-01
申请号：EP10797153.3
申请日：2010-07-07
发明人： YAMAGUCHI, Takashi , KONISHI, Masaya , OTA, Hajime
IPC分类号： H01L39/24
CPC分类号： H01B12/06 , H01L39/2461 , Y02E40/642 , Y10T428/12458 , Y10T428/12611 , Y10T428/12903
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4.发明授权
公开(公告)号：EP2455949B1
公开(公告)日：2016-08-31
申请号：EP10799591.2
申请日：2010-07-08
发明人： OKAYAMA, Hironao , KUROKAWA, Teppei , NANBU, Kouji , ISOBE, Yoshihiko , KOSHIRO, Takashi , KANEKO, Akira , OTA, Hajime , OHKI, Kotaro , YAMAGUCHI, Takashi , OHMATSU, Kazuya
IPC分类号： H01L39/24
CPC分类号： H01L39/2454 , B32B15/01 , B32B15/015 , B32B15/04 , B32B15/20 , C22C9/00 , C22F1/08
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5.发明授权METHOD FOR MANUFACTURING PRECURSOR, METHOD FOR MANUFACTURING SUPERCONDUCTING WIRE, PRECURSOR, AND SUPERCONDUCTING WIRE 有权VEFAHREN用于生产VORLÄUFES，用于生产高温超导线材轧制，Pre和超导线材
公开(公告)号：EP2372722B1
公开(公告)日：2016-03-16
申请号：EP09829005.9
申请日：2009-11-18
发明人： OTA, Hajime
CPC分类号： H01B12/06 , H01L39/2454 , Y10T428/12535 , Y10T428/12944 , Y10T428/31678
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6.发明公开POROUS METAL BODY MANUFACTURING METHOD AND POROUS ALUMINUM BODY, BATTERY ELECTRODE MATERIAL USING METAL POROUS BODY OR POROUS ALUMINUM BODY, AND ELECTRODE MATERIAL FOR ELECTRIC DOUBLE LAYER CAPACITOR 审中-公开法制造金属多孔体，铝多孔体，具有多孔金属体或多孔铝身体和电极材料电池电极材料FOR A双电层电容器的
公开(公告)号：EP2555290A1
公开(公告)日：2013-02-06
申请号：EP11759266.7
申请日：2011-03-16
发明人： KIMURA, Koutarou , NITTA, Koji , HOSOE, Akihisa , INAZAWA, Shinji , OKUNO, Kazuki , MAJIMA, Masatoshi , OTA, Hajime , SAKAI, Shoichiro , GOTO, Kengo , AWAZU, Tomoyuki
CPC分类号： H01M4/80 , H01G11/28 , H01G11/44 , H01G11/46 , H01G11/50 , H01G11/70 , H01G11/86 , H01M4/131 , H01M4/661 , Y02E60/13 , Y10T428/12479
摘要： A porous metal body containing continuous pores and having a low oxygen content is provided by decomposing a porous resin body that contains continuous pores and has a layer of a metal thereon by heating the porous resin body at a temperature equal to or less than the melting point of the metal while the porous resin body is immersed in a first molten salt and a negative potential is applied to the metal layer; and a method for producing the porous metal body is provided.
摘要翻译： 的多孔金属体含有连续孔，并具有低的氧含量是通过分解树脂多孔体没有提供包含连续孔，并通过在比熔点等于或更低的温度下加热多孔树脂体在其上具有金属层 而树脂多孔体浸渍在第一熔融盐和负电势被施加到所述金属层的金属的; 并提供了一种生产多孔金属体的方法。
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7.发明公开SUBSTRATE FOR SUPERCONDUCTING COMPOUND AND METHOD FOR MANUFACTURING THE SUBSTRATE 审中-公开基材复合超导及其制造方法衬底
公开(公告)号：EP2503560A1
公开(公告)日：2012-09-26
申请号：EP10831308.1
申请日：2010-11-12
发明人： OKAYAMA, Hironao , NANBU, Kouji , KANEKO, Akira , OTA, Hajime , OHKI, Kotaro , YAMAGUCHI, Takashi , HAYASHI, Kazuhiko , OHMATSU, Kazuya
CPC分类号： C22C9/00 , B32B15/015 , C21D8/1255 , C22C19/03 , C22C38/007 , C22C38/40 , C22F1/08 , H01L39/2454 , Y10T428/12903 , Y10T428/12924 , Y10T428/12979
摘要： Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed bysuchbonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
摘要翻译： 本发明提供了用于超导化合物和用于制造可与铜的高取向同时实现优异的粘合强度的基板的方法的底物。 在铜箔上以哪个轧制的表面上吸收的材料在90％或更多被去除的草案中的应用通过施加溅射蚀刻在铜箔的表面上，溅射蚀刻被施加到非磁性金属片，铜箔 和金属片，通过使用压延辊将压力施加到所述铜箔和所述金属片彼此结合，在铜箔的铜的晶体通过加热的层叠体构成bysuchbonding取向，铜被扩散到金属板 通过为10nm以上，并且保护层的铜扩散距离加热层压到层叠体的铜箔的表面上。
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公开(公告)号：EP3327160A1
公开(公告)日：2018-05-30
申请号：EP16827564.2
申请日：2016-06-24
发明人： OTA, Hajime , KUWABARA, Tetsuya , YAMAZAKI, Kazuo , SUGIHARA, Naoki , KAWANO, Norimasa , TORAZAWA, Hiroyasu
摘要： There is provided a wire for a reed switch used for a material of a reed piece comprised by a reed switch, the wire being composed of an iron-group alloy containing Fe and 0 mass % or more and less than 10 mass % of Ni, with a total content of the Fe and the Ni satisfying 10 mass % or more and less than 20 mass %, with a balance of Co and an impurity, the iron-group alloy having a cubic crystal structure, the wire having a Curie temperature of 900°C or higher, the wire having a specific resistance of 15 µΩ • cm or less at normal temperature, a ratio of a thermal expansion coefficient of a glass tube comprised by the reed switch to a thermal expansion coefficient of the wire for the reed switch being 90% or more, the wire having a diameter of 1 mm or less.
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9.发明公开SUBSTRATE, METHOD OF PRODUCING SUBSTRATE SUPERCONDUCTING WIRE AND METHOD OF PRODUCING OF SUPERCONDUCTING WIRE 有权底物，用于生产超导线材用于制造超导线材基板和方法
公开(公告)号：EP2453447A1
公开(公告)日：2012-05-16
申请号：EP10797153.3
申请日：2010-07-07
发明人： YAMAGUCHI, Takashi , KONISHI, Masaya , OTA, Hajime
CPC分类号： H01B12/06 , H01L39/2461 , Y02E40/642 , Y10T428/12458 , Y10T428/12611 , Y10T428/12903
摘要： A substrate (1) of the present invention includes a copper layer (2), an alloy layer (3) containing copper and nickel, formed on the copper layer (2), a nickel layer (4) formed on the alloy layer (3), and an intermediate layer (5) formed on the nickel layer (4). The concentration of nickel in the alloy layer (3) at the interface between the alloy layer (3) and the nickel layer (4) is greater than the concentration of nickel in the alloy layer (3) at the interface between the alloy layer (3) and the copper layer (2). According to the present invention, there can be provided a substrate (1) that allows the AC loss of a superconducting wire (7) to be reduced, a method of producing a substrate (1), a superconducting wire (7), and a method of producing a superconducting wire (7).
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10.发明公开METHOD OF PRODUCING SUBSTRATE AND SUPERCONDUCTING WIRE 审中-公开VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS UND SUPRALEITENDEN DRAHTS
公开(公告)号：EP2453446A1
公开(公告)日：2012-05-16
申请号：EP10796995.8
申请日：2010-06-15
发明人： OTA, Hajime , KONISHI, Masaya , YAMAGUCHI, Takashi
CPC分类号： H01L39/2461
摘要： The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer (3) formed on a copper layer (2) through plating, subjecting the nickel layer (3) to thermal treatment at 800-1000°C, and epitaxial-growing an intermediate layer (4) on the nickel layer (3), after the step of subjecting the nickel layer (3) to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer (3) to be improved, and a method of producing the substrate.
摘要翻译： 本发明涉及一种制造基板的方法，包括以下步骤：通过镀敷制备具有在铜层（2）上形成的镍层（3）的基板，对镍层（3）进行800℃热处理， 在对镍层（3）进行热处理的步骤之后，在镍层（3）上外延生长中间层（4）。 根据本发明，可以提供一种能够提高镍层（3）的表面的取向和平坦性的基板，以及制造基板的方法。
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