Thermal recording head and method of manufacturing the same
    1.
    发明公开
    Thermal recording head and method of manufacturing the same 失效
    热记录头及其制造方法

    公开(公告)号:EP0544607A3

    公开(公告)日:1993-08-11

    申请号:EP92460031.5

    申请日:1992-11-24

    申请人: TDK Corporation

    IPC分类号: B41J2/345 B41J2/335

    摘要: A thermal head for thermal recording or thermal transfer recording and a method of manufacturing the head. The head has a heat sink (10) having an upper surface, a heating element substrate (11), disposed on the upper surface of the heat sink, having a projected convex portion (11b) on which an array of heating resistor elements (16) are arranged, an electrical structure mounted on the same side as that of the upper surface of the heat sink means (10) and electrically connected to the heating resistor elements (16), and a protection structure for mechanically protecting the electrical structure. The substrate (11) is constituted that height of the substrate (11) from the surface of the heat sink means (10) is higher than height of the protection structure, and height of the projected convex portion (11b) is equal to or more than 0.6 mm.

    摘要翻译: 用于热记录或热转印记录的热敏头及其制造方法。 头部具有上表面的散热器(10),设置在散热器的上表面上的加热元件基板(11),具有突出的凸部(11b),加热电阻元件阵列(16) ),安装在与散热装置(10)的上表面相同侧并与电加热电阻元件(16)电连接的电气结构,以及用于机械地保护电气结构的保护结构。 基板(11)由基板(11)从散热装置(10)的表面的高度高于保护结构的高度构成,突出的凸部(11b)的高度等于或等于 大于0.6毫米。

    Thermal recording head and method of manufacturing the same
    2.
    发明公开
    Thermal recording head and method of manufacturing the same 失效
    Thermischer Aufzeichnungskopf und sein Herstellungsverfahren。

    公开(公告)号:EP0544607A2

    公开(公告)日:1993-06-02

    申请号:EP92460031.5

    申请日:1992-11-24

    申请人: TDK Corporation

    IPC分类号: B41J2/345 B41J2/335

    摘要: A thermal head for thermal recording or thermal transfer recording and a method of manufacturing the head. The head has a heat sink (10) having an upper surface, a heating element substrate (11), disposed on the upper surface of the heat sink, having a projected convex portion (11b) on which an array of heating resistor elements (16) are arranged, an electrical structure mounted on the same side as that of the upper surface of the heat sink means (10) and electrically connected to the heating resistor elements (16), and a protection structure for mechanically protecting the electrical structure. The substrate (11) is constituted that height of the substrate (11) from the surface of the heat sink means (10) is higher than height of the protection structure, and height of the projected convex portion (11b) is equal to or more than 0.6 mm.

    摘要翻译: 用于热记录或热转印记录的热敏头及其制造方法。 头部具有上表面的散热器(10),设置在散热器的上表面上的加热元件基板(11),具有突出的凸部(11b),加热电阻元件阵列(16) ),安装在与散热装置(10)的上表面相同侧并与电加热电阻元件(16)电连接的电气结构,以及用于机械地保护电气结构的保护结构。 基板(11)由基板(11)从散热装置(10)的表面的高度高于保护结构的高度构成,突出的凸部(11b)的高度等于或等于 大于0.6毫米。