公开(公告)号：EP0821745A1

公开(公告)日：1998-02-04

申请号：EP96911614.0

申请日：1996-04-08

申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS

发明人： GLEZEN, John, H. ,  NASEEM, Hameed, A. ,  BROWN, William, D. ,  SCHAPER, Leonard, W. ,  MALSHE, Ajay, P.

IPC分类号： C25D5 ,  C25D7

CPC分类号： C25D5/10 ,  C25D5/54

摘要： Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density J0, to form a conductive metal layer (30) having a surface roughness no greater than the surface roughness (20) of the underlying member (10). In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.