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1.
公开(公告)号:EP3937256A1
公开(公告)日:2022-01-12
申请号:EP21184739.7
申请日:2021-07-09
IPC分类号: H01L29/775 , H01L29/786 , H01L21/336 , H01L29/08 , B82Y10/00 , H01L29/06 , H01L29/423 , H01L29/66 , H01L29/78
摘要: A semiconductor device includes a first active fin structure (300A) and a second active fin structure (300B) extending along a first lateral direction. The semiconductor device includes a dummy fin structure (600A), also extending along the first lateral direction, that is disposed between the first active fin structure and the second fin structure. The dummy fin structure includes a material, for example silicon nitride or silicon germanium, that is configured to induce mechanical deformation of a first source/drain structure (1100) coupled to an end of the first active fin structure and a second source/drain structure coupled to an end of the second active fin structure.