公开(公告)号：EP3201664A1

公开(公告)日：2017-08-09

申请号：EP15794067.7

申请日：2015-09-25

申请人： Technische Universität Berlin ,  IHP GmbH-Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik

发明人： RHEE, Hanjo ,  HENNIGES, Marvin ,  MEISTER, Stefan ,  THEISS, Christoph ,  SELICKE, David ,  STOLAREK, David ,  ZIMMERMANN, Lars ,  RICHTER, Harald H.

IPC分类号： G02B6/124

CPC分类号： G02B6/124 ,  G02B6/136 ,  G02B6/42 ,  G02B6/4206 ,  G02B2006/12097 ,  G02B2006/12107

摘要： The invention relates, inter alia, to a photonically integrated chip (2) having a substrate (20), a plurality of material layers arranged on a top side (21) of the substrate (20), an optical waveguide which is integrated in one or more wave-guiding material layers of the chip (2), and a grating coupler (60) which is formed in the optical waveguide and effects beam deflection of radiation guided in the waveguide in the direction out of the layer plane of the wave-guiding material layer(s) or effects beam deflection of radiation to be coupled into the waveguide in the direction into the layer plane of the wave-guiding material layer(s). With respect to the chip, the invention provides for an optical diffraction and refraction structure (100, 100a) which carries out beam forming of the radiation before being coupled into the waveguide or after being coupled out of the waveguide to be integrated in a material layer of the chip (2) above or below the optical grating coupler (60) or in a plurality of material layers above or below the optical grating coupler (60) or on the rear side of the substrate (20).

摘要翻译： 本发明尤其涉及一种光子集成芯片（2），其具有衬底（20），布置在衬底（20）的顶侧（21）上的多个材料层，集成在一个衬底 或更多的波导材料层，以及光栅耦合器（60），该光栅耦合器形成在光波导中并且实现波导中引导的辐射的波束偏转在波导的层平面之外， 引导材料层或实现在波导材料层的层平面内的方向上耦合到波导中的辐射的波束偏转。 关于芯片，本发明提供了一种光学衍射和折射结构（100,100a），其在耦合到波导中之前或者在被耦合出波导之后执行辐射的波束形成，以被集成到材料层中 在所述光栅耦合器（60）的上方或下方或在所述光栅耦合器（60）的上方或下方或所述衬底（20）的后侧上的多个材料层中的所述芯片（2）。