公开(公告)号：EP1987306A1

公开(公告)日：2008-11-05

申请号：EP07726420.8

申请日：2007-02-16

申请人： Thales Nederland B.V.

发明人： WITS, Wessel, Willems ,  MANNAK, Jan, Hendrik ,  LEGTENBERG, Rob

IPC分类号： F28D15/04

CPC分类号： H05K1/0272 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K3/4623 ,  H05K2201/09036 ,  H05K2201/09981 ,  H05K2203/083 ,  H01L2924/00

摘要： There is disclosed a planar heat pipe for cooling, which is embedded in a printed circuit board for cooling of heat-dissipating components (13). The planar heat pipe includes two panels (1, 2) that are both metal clad on one side (4, 5), at least one of the panels (1, 2) being grooved (9) on its metal clad side, the panels (1, 2) being assembled by their metal clad sides to form a sealed cavity (8), the cavity (8) being filled with a fluid (10), the fluid (10) circulating by capillary action along the grooves (9) towards zones exposed to heat where it vaporizes.

摘要翻译： 公开了一种用于冷却的平面热管的装置，其可以嵌入用于冷却散热部件的印刷电路板中。 该设备包括两个面板，两个面板在一侧是金属包层的，至少一个面板在其金属包覆侧上开槽，面板由其金属包层侧组装以形成密封空腔，空腔充满流体 流体通过毛细作用沿着凹槽循环到暴露于其中蒸发的热的区域。 应用：电子，冷却，印刷电路板