公开(公告)号：EP4462971A1

公开(公告)日：2024-11-13

申请号：EP24163278.5

申请日：2024-03-13

申请人： The Boeing Company

发明人： HWANG, Kyu-Pyung ,  MITCHUM, Thomas D. ,  BOETTCHER, Philipp Andreas ,  SONG, Young

IPC分类号： H05K9/00

摘要： An assembly for electromagnetic interference (EMI) shielding to prevent incident radiation from penetrating through a gap to an interior of an aircraft comprises an electromagnetic band gap (EBG) structure. The EBG structure has a patch-and-via array connected to a ground layer. The EMI shielding includes a conductive adhesive and is flexible for conforming attachment to curved aircraft surfaces. The shielding may be located on a deflector plate that is parallel to an adjacent aircraft surface, on the airframe surface opposite to the deflector plate, or in both locations. The assembly filters out penetrating electromagnetic energy and prevents highly resonant cavity mode buildups of electromagnetic energy inside a nacelle or other enclosure effectively protecting electrical equipment in the interior.