GROUNDING DEVICE FOR BUNDLED CABLES
    1.
    发明公开
    GROUNDING DEVICE FOR BUNDLED CABLES 审中-公开
    地面装置对于联合CABLE

    公开(公告)号:EP2064792A2

    公开(公告)日:2009-06-03

    申请号:EP07755152.1

    申请日:2007-04-10

    IPC分类号: H02G15/08

    CPC分类号: H01R4/646 H01R4/36 H01R9/2483

    摘要: A device (10) for electrically grounding bundled cables includes a first half component (12) having an outer surface portion (16) and an abutting surface portion (18), and a second halt component (14) having an outer surface portion (28) and an abutting surface portion (29). The outer surface portion (16) of the first half component (12) and the outer suface portion (28) of the second halt component (14) each define at least one groove (20,30) longitudinally extending therealong for accommodating one of a plurality of cables held closely together in a bundled configuration. The abutting surface portion (18) of the first half component (12) and the abutting surface portion (29) of the second half component (14) are configured for engaging and cooperating with one another to form a grounding structure.