Substrate treating system and substrate treating method
    1.
    发明公开
    Substrate treating system and substrate treating method 失效
    基板处理系统及基板处理方法

    公开(公告)号:EP1400760A1

    公开(公告)日:2004-03-24

    申请号:EP03024189.7

    申请日:2003-10-24

    IPC分类号: F24F3/16 F24F11/02 H01L21/00

    摘要: The present invention provides a substrate treating system for successively treating a plurality of substrates W under an air-conditioned environment. The system comprises an outer casing (100a, 302) provided with a cassette transfer port (100b, 304) through which a cassette (CR, C) is transferred, a cassette section (10, 351) having a cassette table (20, 303) arranged within an inner space surrounded by the outer casing for supporting the cassette transferred through the cassette transfer port, a sub-arm mechanism (22, 311) for taking the substrates one by one from the cassette section, a process section (12, 352) positioned adjacent to the cassette section and having a plurality of treating units for treating the substrates arranged therein, a main arm mechanism (24, 312, 313) arranged within the process section for receiving the substrates from the sub-arm mechanism arranged in the cassette section and, then, transferring the received substrates to each of the treating units while transferring the treated substrates out of the treating units, an air supply mechanism (10a, 10b, 12a, 14a, 16a to 16e, 30, 31, 32, 33a to 33f, 34, 36, 37a to 37e, 38, 39, 48, 306, 306a, 306b) for supplying a clean air to form a down-stream within the space surrounded by the outer casing (100a, 302), and a partition plate (11, 11A, 29, 51, 61, 305) for partitioning the inner space surrounded by the outer casing (100a, 302) not to interfere the down-flow of the air formed by the air supply mechanism, the partition plate having a substrate transfer port (11a, 11b, 29a, 51a, 61a, 308) through which the substrate is transferred from one of the partitioned spaces to the other partitioned space.