公开(公告)号：EP2511063B1

公开(公告)日：2018-11-28

申请号：EP10835939.9

申请日：2010-12-06

申请人： Towa Corporation

发明人： URATANI, Takafumi ,  TAKEUCHI, Shin ,  SHIRASAWA, Masanori ,  TAKAHASHI, Koichi

IPC分类号： B29C45/14 ,  B29C45/02 ,  B29L31/34 ,  B29C39/10 ,  B29C39/38 ,  B29C45/72

CPC分类号： B29C45/1468 ,  B29C45/02 ,  B29C45/14065 ,  B29C45/72 ,  B29C2045/14131 ,  B29C2045/14877

摘要： The present invention provides a resin-sealing apparatus used in manufacturing an electronic unit, including: a tray 7 on which a pre-sealed substrate 4 is placed; a preheating mechanism 14 on which the tray 7 with the pre-sealed substrate 4 is placed thereon is placed; a first transfer mechanism 12 for transferring the tray 7 on which the pre-sealed substrate 4 is placed to the preheating mechanism 14 and placing the tray 7 on the preheating mechanism 14; a resin-sealing mold 17 having a cavity to be filled with fluid resin; a carry-in mechanism 16 for carrying the pre-heated pre-sealed substrate 4 to the resin-sealing mold 17 and placing the pre-sealed substrate 4 on the resin-sealing mold 17; and a taking-out mechanism 19 for taking out a resin-sealed product 5 which has been formed by resin-sealing the pre-sealed substrate 4 with a cured resin, which is a cured fluid resin, from the resin-sealing mold 17. The tray 7 is composed of a recess corresponding to a projection of the pre-sealed substrate 4. The pre-sealed substrate 4 is placed on the tray 7 with the projection and recess being aligned.

公开(公告)号：EP2511063A1

公开(公告)日：2012-10-17

申请号：EP10835939.9

申请日：2010-12-06

申请人： Towa Corporation

发明人： URATANI, Takafumi ,  TAKEUCHI, Shin ,  SHIRASAWA, Masanori ,  TAKAHASHI, Koichi

IPC分类号： B29C45/14 ,  B29C45/02 ,  B29L31/34

CPC分类号： B29C45/1468 ,  B29C45/02 ,  B29C45/14065 ,  B29C45/72 ,  B29C2045/14131 ,  B29C2045/14877

摘要： The present invention provides a resin-sealing apparatus used in manufacturing an electronic unit, including: a tray 7 on which a pre-sealed substrate 4 is placed; a preheating mechanism 14 on which the tray 7 with the pre-sealed substrate 4 is placed thereon is placed; a first transfer mechanism 12 for transferring the tray 7 on which the pre-sealed substrate 4 is placed to the preheating mechanism 14 and placing the tray 7 on the preheating mechanism 14; a resin-sealing mold 17 having a cavity to be filled with fluid resin; a carry-in mechanism 16 for carrying the pre-heated pre-sealed substrate 4 to the resin-sealing mold 17 and placing the pre-sealed substrate 4 on the resin-sealing mold 17; and a taking-out mechanism 19 for taking out a resin-sealed product 5 which has been formed by resin-sealing the pre-sealed substrate 4 with a cured resin, which is a cured fluid resin, from the resin-sealing mold 17. The tray 7 is composed of a recess corresponding to a projection of the pre-sealed substrate 4. The pre-sealed substrate 4 is placed on the tray 7 with the projection and recess being aligned.

摘要翻译： 本发明提供一种用于制造电子单元的树脂密封装置，包括：托盘7，其上放置预密封基板4; 放置有预先密封的基板4的托盘7放置在其上的预热机构14; 用于将其上放置有预密封基板4的托盘7传送到预热机构14并将托盘7放置在预热机构14上的第一传送机构12; 具有填充有流体树脂的空腔的树脂密封模具17; 用于将预热的预密封基板4运送到树脂密封模具17并将预密封的基板4放置在树脂密封模具17上的携带机构16; 以及取出机构19，其从树脂密封模具17取出通过用固化树脂树脂密封预密封基板4而形成的树脂密封产品5。 托盘7由与预先密封的基板4的突起相对应的凹部构成。预先密封的基板4被放置在托盘7上，突起和凹槽对齐。