专利检索 ap:("Tyco Electronics Corporation") AND inv:"DOOLEY, Christine, Ann" 第 1 页

1.

发明授权
MODULE ASSEMBLY HAVING INTERFACE MODULE AND INSERTABLE MODULAR JACK 有权
标题翻译：与接口模块与模块连接器EINFÜHRBAREM模块组装

公开(公告)号：EP2179476B1

公开(公告)日：2015-09-02

申请号：EP08794853.5

申请日：2008-07-30

申请人： Tyco Electronics Corporation

发明人： HERNDON, Stephen, Scott , BURWELL, Robert, Jeffrey , GENIAC, Joseph, Edward , DOOLEY, Christine, Ann

IPC分类号： H01R13/518 , H01R13/74 , H01R24/64

CPC分类号： H01R13/518 , H01R13/745 , H01R24/64

2.

发明公开
MODULE ASSEMBLY HAVING INTERFACE MODULE AND INSERTABLE MODULAR JACK 有权
标题翻译：与接口模块与模块连接器EINFÜHRBAREM模块组装

公开(公告)号：EP2179476A2

公开(公告)日：2010-04-28

申请号：EP08794853.5

申请日：2008-07-30

申请人： Tyco Electronics Corporation

发明人： HERNDON, Stephen, Scott , BURWELL, Robert, Jeffrey , GENIAC, Joseph, Edward , DOOLEY, Christine, Ann

IPC分类号： H01R13/518 , H01R13/74 , H01R24/04

CPC分类号： H01R13/518 , H01R13/745 , H01R24/64

摘要： A module assembly including an interface module (120) including a housing having a plurality of jack cavities (138) and associated jack latch openings (146). The housing is configured to be mated with a patch panel (100). The module assembly also includes a plurality of modular jacks (122) that are directly inserted into corresponding jack cavities (138). Each modular jack (122) includes a single latch arm (166) that engages the jack latch opening (146) to retain the modular jack (122) in the jack cavity (138). Optionally, each modular jack (122) may include a top surface and a bottom surface (184), wherein the latch arm (166) extends from the top surface and wherein the bottom surface (184) is planar. The bottom surface may rest flush with a bottom wall (184) of the jack cavity.