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公开(公告)号：EP2151019B1
公开(公告)日：2012-07-11
申请号：EP08754613.1
申请日：2008-05-21
发明人： DUESTERHOEFT, Scott, Stephen , DAILY, Christopher, George , WEBER, Ronald, Martin , MOSTOLLER, Matthew, E.
IPC分类号： H01R12/50
CPC分类号： H01R12/616 , H01R12/68 , H01R12/772 , H01R12/78
摘要： A connector apparatus (100) for connecting at least two electronic component substrates (150, 152), for example, printed circuit boards or flex circuits, to one another at the edges thereof, wherein each of the at least two substrates (150, 152) further comprises at least one electrically conductive contact surface (151, 153), and wherein the connector apparatus (100) further includes: at least one electrically conductive transverse conducting member (140), wherein a first portion of the at least one transverse conducting member (140) physically touches the contact surface (151) on the first substrate (150), and wherein a second portion of the transverse conducting member (140) physically touches the contact surface (153) on the second substrate (152); and mechanical means for securing the at least one transverse conducting member (140) to each of the substrates (150, 152) and to each of the contact surfaces (151, 153).
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公开(公告)号：EP2151019A1
公开(公告)日：2010-02-10
申请号：EP08754613.1
申请日：2008-05-21
发明人： DUESTERHOEFT, Scott, Stephen , DAILY, Christopher, George , WEBER, Ronald, Martin , MOSTOLLER, Matthew, E.
IPC分类号： H01R12/02
CPC分类号： H01R12/616 , H01R12/68 , H01R12/772 , H01R12/78
摘要： A connector apparatus (100) for connecting at least two electronic component substrates (150, 152), for example, printed circuit boards or flex circuits, to one another at the edges thereof, wherein each of the at least two substrates (150, 152) further comprises at least one electrically conductive contact surface (151, 153), and wherein the connector apparatus (100) further includes: at least one electrically conductive transverse conducting member (140), wherein a first portion of the at least one transverse conducting member (140) physically touches the contact surface (151) on the first substrate (150), and wherein a second portion of the transverse conducting member (140) physically touches the contact surface (153) on the second substrate (152); and mechanical means for securing the at least one transverse conducting member (140) to each of the substrates (150, 152) and to each of the contact surfaces (151, 153).
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