公开(公告)号：EP2537179A1

公开(公告)日：2012-12-26

申请号：EP10848614.3

申请日：2010-10-08

Applicant: Veeco Instruments Inc.

Inventor： WANG, Jianmin ,  METZNER, Craig ,  SCHUH, Gregory, W.

IPC: H01L21/46

CPC classification number: B23K26/0676 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/50 ,  G02B27/283

Abstract: A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a wafer thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system (100) utilizes a beam expander (220), two half- wave plates (224, 238), a polarizing beam splitter (228), a mirror (236), and two lenses (234, 242) to provide two identical laser beams (202, 204) from a single laser source (214). The identical laser beams (202, 204) are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates (224) is rotated to yield laser beams with the same power. The other half- wave plate (238) is rotated to yield laser beams with the same polarization direction.

Abstract translation: 双光束激光切割系统使用激光束偏振来输出两个相同的激光束。 与单一激光切割系统相比，双重相同的激光束适当间隔以同时切割晶圆，从而增加激光切割系统的产量。 在一个实施方式中，双光束激光切割系统（100）利用光束扩展器（220），两个半波片（224,238），偏振分束器（228），反射镜（236）和两个透镜 （234,242）以从单个激光源（214）提供两个相同的激光束（202,204）。 相同的激光束（202,204）被调谐为具有相同的功率，横截面直径和偏振方向。 旋转一个半波片（224）以产生具有相同功率的激光束。 另一个半波片（238）旋转以产生具有相同偏振方向的激光束。