SPUTTER TARGET AND SPUTTERING METHODS
    4.
    发明公开
    SPUTTER TARGET AND SPUTTERING METHODS 审中-公开
    溅射靶和溅射方法

    公开(公告)号:EP2726642A2

    公开(公告)日:2014-05-07

    申请号:EP12804836.0

    申请日:2012-06-14

    申请人: View, Inc.

    IPC分类号: C23C14/34

    摘要: The present disclosure concerns sputter targets and sputtering methods. In particular, sputter targets and methods of sputtering using conventional sputter targets as well as sputter targets described herein, for highly uniform sputter deposition, are described.

    摘要翻译: 本公开涉及溅射靶和溅射方法。 具体而言,描述了用于高度均匀溅射沉积的使用常规溅射靶以及本文所述的溅射靶的溅射靶和溅射方法。