-
公开(公告)号：EP2682956A1
公开(公告)日：2014-01-08
申请号：EP13186503.2
申请日：2008-09-30
CPC分类号： H01C17/003 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/288 , Y10T29/49082 , Y10T29/49098
摘要： A metal strip resistor (10) is provided. The metal strip resistor includes a metal strip (18) forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material (20) overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor (10) wherein a metal strip (18) provides support for the metal strip resistor (10) without use of a separate substrate is provided. The method includes coating an insulative material (20) to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.
摘要翻译： 提供金属带状电阻（10）。 金属带电阻器包括形成电阻元件的金属条（18），并且不使用单独的衬底来提供对金属条电阻器的支撑。 存在覆盖金属条的第一和第二相对端子。 每个第一和第二相对端子上都有电镀。 还有在第一和第二相对端子之间覆盖金属带的绝缘材料（20）。 提供了一种用于形成金属带状电阻器（10）的方法，其中金属带（18）不使用单独的衬底为金属带状电阻器（10）提供支撑。 该方法包括将绝缘材料（20）涂覆到金属条上，施加光刻工艺以形成覆盖电阻材料的导电图案，其中导电图案包括第一和第二相对端子，电镀导电图案，并调整金属的电阻 跳闸。
-
公开(公告)号：EP2498265B1
公开(公告)日：2013-12-11
申请号：EP12163001.6
申请日：2008-09-30
CPC分类号： H01C17/003 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/288 , Y10T29/49082 , Y10T29/49098
-
公开(公告)号：EP2498265A3
公开(公告)日：2012-10-03
申请号：EP12163001.6
申请日：2008-09-30
CPC分类号： H01C17/003 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/288 , Y10T29/49082 , Y10T29/49098
摘要： A metal strip resistor (10) is provided. The metal strip resistor includes a metal strip (18) forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the' conductive pattern, and adjusting resistance of the metal strip.
-
公开(公告)号：EP2498265A2
公开(公告)日：2012-09-12
申请号：EP12163001.6
申请日：2008-09-30
CPC分类号： H01C17/003 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/288 , Y10T29/49082 , Y10T29/49098
摘要： A metal strip resistor (10) is provided. The metal strip resistor includes a metal strip (18) forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the' conductive pattern, and adjusting resistance of the metal strip.
摘要翻译： 提供金属带状电阻器（10）。 该金属带状电阻器包括形成电阻元件并且在不使用单独的衬底的情况下为金属带状电阻器提供支撑的金属带（18）。 有第一和第二相反终端覆盖金属带。 第一个和第二个相反的端子都有电镀。 在第一和第二相对端子之间还有覆盖金属带的绝缘材料。 提供一种用于形成金属带状电阻器的方法，其中金属带提供对金属带状电阻器的支撑而不使用单独的衬底。 该方法包括将绝缘材料涂覆到金属带上，应用光刻工艺以形成覆盖电阻材料的导电图案，其中导电图案包括第一和第二相反端子，电镀导电图案并调节金属带的电阻。
-
-
-
搜索结果
4 条记录 (耗时 0.008 秒)
