Temperature probe
    1.
    发明公开
    Temperature probe 失效
    温度探头。

    公开(公告)号:EP0153661A2

    公开(公告)日:1985-09-04

    申请号:EP85101573.5

    申请日:1985-02-13

    发明人: Gotcher, Ricky G.

    IPC分类号: G01K7/18 G01K13/02

    CPC分类号: G01K13/02 G01K7/18

    摘要: There is provided a temperature probe for measuring the temperature of the probe's surroundings and including a tip casing (20) having an interior casing cavity (22) in fluid communication with the probe's surroundings and at least one interior wall cavity (34) located with respect to the Interior casing cavity (22) to facilitate heat transfer between the two cavities. A sensor such as a resistance temperature detector (38) is mounted in the interior wall cavity (34) and surrounded by sufficient packing (40) to electrically insulate the sensor (38) from the tip casing wall. A support casing (50) Is mated to one end of the tip casing with at least that portion of the support casing (50) adjacent to the tip casing (20) having an effective thermal conductivity lower than that of the tip casing (20). A heat dissipation mechanism such as a plurality of fins (60) attached to the support casing (50) may also be provided to limit heat transfer down the length of the support casing from the tip casing (20).

    Temperature probe
    3.
    发明公开
    Temperature probe 失效
    温度探头

    公开(公告)号:EP0153661A3

    公开(公告)日:1987-04-15

    申请号:EP85101573

    申请日:1985-02-13

    发明人: Gotcher, Ricky G.

    IPC分类号: G01K07/18 G01K13/02

    CPC分类号: G01K13/02 G01K7/18

    摘要: There is provided a temperature probe for measuring the temperature of the probe's surroundings and including a tip casing (20) having an interior casing cavity (22) in fluid communication with the probe's surroundings and at least one interior wall cavity (34) located with respect to the Interior casing cavity (22) to facilitate heat transfer between the two cavities. A sensor such as a resistance temperature detector (38) is mounted in the interior wall cavity (34) and surrounded by sufficient packing (40) to electrically insulate the sensor (38) from the tip casing wall. A support casing (50) Is mated to one end of the tip casing with at least that portion of the support casing (50) adjacent to the tip casing (20) having an effective thermal conductivity lower than that of the tip casing (20). A heat dissipation mechanism such as a plurality of fins (60) attached to the support casing (50) may also be provided to limit heat transfer down the length of the support casing from the tip casing (20).