EPITAXIAL GROWTH METHOD AND EQUIPMENT
    2.
    发明公开

    公开(公告)号:EP4350739A1

    公开(公告)日:2024-04-10

    申请号:EP22814742.7

    申请日:2022-02-16

    IPC分类号: H01L21/02 H01L21/67

    摘要: The invention relates to the manufacture of semiconductor devices, and more particularly, to an epitaxial growth method and device. The epitaxial growth method is to provide cooling gas entering a cooling chamber from a reaction gas outlet in an epitaxial growth process. The epitaxial growth device comprises a cooling gas inlet which is distributed in a position, close to the reaction gas outlet, of the cooling chamber. According to the epitaxial growth method and the epitaxial growth device disclosed in the present invention, epitaxial growth of 50 um thick film on a 300 mm silicon wafer can be completed at one time without forming a covering layer on the reaction chamber.