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公开(公告)号:EP2752085B1
公开(公告)日:2016-03-30
申请号:EP12772154.6
申请日:2012-08-30
发明人: PTASIENSKI, Kevin , BOLDT, Allen, Norman , SMITH, Janet, Lea , SWANSON, Cal, Thomas , NOSRATI, Mohammad , SMITH, Kevin, Robert
IPC分类号: H05B1/02 , H05B3/26 , H01L21/67 , H05B1/00 , H01L21/683
CPC分类号: H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
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公开(公告)号:EP2752085A1
公开(公告)日:2014-07-09
申请号:EP12772154.6
申请日:2012-08-30
发明人: PTASIENSKI, Kevin , BOLDT, Allen, Norman , SMITH, Janet, Lea , SWANSON, Cal, Thomas , NOSRATI, Mohammad , SMITH, Kevin, Robert
CPC分类号: H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/67248 , H01L21/6833 , H05B1/00 , H05B1/02 , H05B1/0202 , H05B1/0227 , H05B1/0233 , H05B3/02 , H05B3/06 , H05B3/20 , H05B2203/005 , H05B2203/013 , H05B2213/03 , Y10T156/10
摘要: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.
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