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公开(公告)号：EP0831208A3
公开(公告)日：1998-12-02
申请号：EP97116289.6
申请日：1997-09-18
发明人： Murai, Takayuki , Anamoto, Takayuki
CPC分类号： F01M3/02 , F02B2075/025
摘要： A lubricating-oil supply system for a two-stroke cycle engine, comprises an oil pump supplying lubricating oil from an oil tank to various areas of said engine. Said oil pump is electrically drivable by an electromagnetic solenoid. A control unit is adapted to electrically control this electromagnetic solenoid according to the operating state of the engine. This electromagnetic solenoid and said oil pump are enclosed within one case and that between one end of said case and said electromagnetic solenoid there is provided a spacer means for holding said electromagnetic solenoid in a certain distance to the first end.
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公开(公告)号：EP0831208A2
公开(公告)日：1998-03-25
申请号：EP97116289.6
申请日：1997-09-18
发明人： Murai, Takayuki , Anamoto, Takayuki
CPC分类号： F01M3/02 , F02B2075/025
摘要： A lubricating-oil supply system for a two-stroke cycle engine, comprises an oil pump supplying lubricating oil from an oil tank to various areas of said engine. Said oil pump is electrically drivable by an electromagnetic solenoid. A control unit is adapted to electrically control this electromagnetic solenoid according to the operating state of the engine. This electromagnetic solenoid and said oil pump are enclosed within one case and that between one end of said case and said electromagnetic solenoid there is provided a spacer means for holding said electromagnetic solenoid in a certain distance to the first end.
摘要翻译： 一种用于二冲程循环发动机的润滑油供应系统，包括将来自油箱的润滑油供应到所述发动机的各个区域的油泵。 所述油泵可由电磁螺线管电驱动。 控制单元适于根据发动机的运行状态电控制该电磁螺线管。 该电磁螺线管和所述油泵封闭在一个壳体内，并且在所述壳体的一端和所述电磁螺线管之间设置有用于将所述电磁螺线管保持在距所述第一端一定距离处的间隔件装置。
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公开(公告)号：EP1434268B1
公开(公告)日：2007-02-14
申请号：EP03029242.9
申请日：2003-12-18
发明人： Morita, Koji , Yoshikawa, Takao , Murai, Takayuki
IPC分类号： H01L25/07 , H01L23/373 , H01L23/485
CPC分类号： H01L25/072 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/48747 , H01L2224/49 , H01L2224/73265 , H01L2224/85447 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
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公开(公告)号：EP1434268A3
公开(公告)日：2004-08-25
申请号：EP03029242.9
申请日：2003-12-18
发明人： Morita, Koji , Yoshikawa, Takao , Murai, Takayuki
IPC分类号： H01L25/07 , H01L23/373 , H01L23/485
CPC分类号： H01L25/072 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/48747 , H01L2224/49 , H01L2224/73265 , H01L2224/85447 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
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5.发明公开Electronic substrate, power module and motor driver 有权Elektronisches Substrat，Leistungsmodul und Motorantrieb
公开(公告)号：EP1434268A2
公开(公告)日：2004-06-30
申请号：EP03029242.9
申请日：2003-12-18
发明人： Morita, Koji , Yoshikawa, Takao , Murai, Takayuki
IPC分类号： H01L25/07 , H01L23/373 , H01L23/485
CPC分类号： H01L25/072 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/48747 , H01L2224/49 , H01L2224/73265 , H01L2224/85447 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
摘要翻译： 电子基板用于在其上安装多个半导体芯片。 衬底包括第一导电构件，第二导电构件和绝缘层。 第一导电构件电连接到半导体芯片之一。 第二导电构件电连接到另一个半导体芯片。 绝缘层被布置成将第二导电构件与第一导电构件电隔离。 第一导电构件是在其上支撑绝缘层，半导体芯片和第二导电构件的导电基底。
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