公开(公告)号：EP0572195A1

公开(公告)日：1993-12-01

申请号：EP93304002.4

申请日：1993-05-24

申请人： YAMAICHI ELECTRIC CO., LTD.

发明人： Matsuoka, Noriyuki ,  Tsubota, Eisaku

IPC分类号： H05K7/10

CPC分类号： H05K7/1023 ,  H01R12/716 ,  H01R13/24

摘要： A socket for an IC package including a plurality of contacts arranged in array in such a manner as to correspond to a plurality of IC leads of an IC package, each of the contacts comprising a first unitary contact extending to a lower surface portion of each of the unitary IC leads so as to be brought into pressure contact with the lower surface portion, and a second unitary contact extending to a side surface portion of the lead so as to be brought into pressure contact with the side surface portion, the first and second unitary contacts having male terminals separately connected to a wiring board, respectively.

摘要翻译： 一种用于IC封装的插座，包括以与IC封装的多个IC引线对应的方式排列成阵列的多个触点，每个触点包括延伸到每个的下表面部分的第一单一触点 单体IC引出以与下表面部压力接触，第二单一接触件延伸到引线的侧表面部分以与侧表面部分压力接触，第一和第二 单个触点具有分别连接到布线板的阳端子。