摘要:
The present invention relates to an ultrasound therapy system using high-intensity focused ultrasound. The present invention improves ultrasound and heat release characteristics and provides an ultrasound probe which easily performs manufacturing and maintenance processes. According to the present invention, a housing is recessed on the inward side around the upper-part edge. A plurality of mounting holes are uniformly formed from the outside at a constant radius to the edge in the center of the upper part. And a plurality of probe units are respectively installed to the plurality of mounting holes to form a sphere in the upper part of the housing wherein a first connection pin is protruded to the lower part of the housing in the lower part of a copper connection bar and a rear block, a piezoelectric wafer, and an acoustic matching layer are sequentially stacked on the upper part of the connection bar. A grounding film can be stacked on the acoustic matching layer. The upper surface of the plurality of probe units installed on the housing, the grounding film, forms a sphere.
摘要:
The present invention relates to a unit ultrasonic wave probe, an ultrasonic wave probe module, and an ultrasonic wave probe device. The unit ultrasonic probe according to the present invention includes: a rear block part; a flexible substrate part arranged on the top of the rear block part; and a piezoelectric wafer arranged on the top of and electrically connected with the flexible substrate part, the wafer being formed to have a smaller size than the rear block part, so that even if increasing the number of piezoelectric wafers transversely, the number of channels is increased by depositing the unit ultrasonic wave probe including the piezoelectric wafer, thus preventing the cost from geometrically increasing because of the structure of the flexible substrate becoming complex.
摘要:
The present invention relates to a detachably joined ultrasonic probe device, including modular ultrasonic probe and a case for detachably joining with the modular ultrasonic probes, which enables the user to select a suitable ultrasonic probe according to desired performance and diagnosis frequency region. The device according to the present invention includes: a plurality of ultrasonic probe modules horizontally arranged in the direction of generating an ultrasonic wave; a case consisting of an outer housing with one open side for receiving and enclosing the plurality of ultrasonic probe modules, and a separation housing provided between the plurality of ultrasonic probe modules for separating the ultrasonic modules from one another, so as to detachably join with the ultrasonic modules; and a control module installed in the case for controlling the plurality of ultrasonic probe modules.
摘要:
The present invention relates to a detachably joined ultrasonic probe device, including modular ultrasonic probe and a case for detachably joining with the modular ultrasonic probes, which enables the user to select a suitable ultrasonic probe according to desired performance and diagnosis frequency region. The device according to the present invention includes: a plurality of ultrasonic probe modules horizontally arranged in the direction of generating an ultrasonic wave; a case consisting of an outer housing with one open side for receiving and enclosing the plurality of ultrasonic probe modules, and a separation housing provided between the plurality of ultrasonic probe modules for separating the ultrasonic modules from one another, so as to detachably join with the ultrasonic modules; and a control module installed in the case for controlling the plurality of ultrasonic probe modules.
摘要:
A multilayer ultrasonic transducer includes a multilayer piezoelectric substrate assembly (100) laminated with a first and a second piezoelectric substrate on top of each other, and having a first electrode node (42) and a second electrode (44) node polarized with a primary electrode and a secondary electrode, respectively, a flexible printed circuit board coupled to the first electrode node, a backing block with a predetermined thickness surrounded by the flexible printed circuit board, a ground flexible printed circuit board coupled to the second electrode node, and an acoustic matching layer deposited on the multilayer piezoelectric substrate assembly.
摘要:
The present invention relates to a unit ultrasonic wave probe, an ultrasonic wave probe module, and an ultrasonic wave probe device. The unit ultrasonic probe according to the present invention includes: a rear block part; a flexible substrate part arranged on the top of the rear block part; and a piezoelectric wafer arranged on the top of and electrically connected with the flexible substrate part, the wafer being formed to have a smaller size than the rear block part, so that even if increasing the number of piezoelectric wafers transversely, the number of channels is increased by depositing the unit ultrasonic wave probe including the piezoelectric wafer, thus preventing the cost from geometrically increasing because of the structure of the flexible substrate becoming complex.
摘要:
A multilayer ultrasonic transducer includes a multilayer piezoelectric substrate assembly (100) laminated with a first and a second piezoelectric substrate on top of each other, and having a first electrode node (42) and a second electrode (44) node polarized with a primary electrode and a secondary electrode, respectively, a flexible printed circuit board coupled to the first electrode node, a backing block with a predetermined thickness surrounded by the flexible printed circuit board, a ground flexible printed circuit board coupled to the second electrode node, and an acoustic matching layer deposited on the multilayer piezoelectric substrate assembly.
摘要:
The present invention provides an ultrasonic probe which includes a heat sink (150) provided in a rear layer (140) to dissipate heat. The heat sink is coupled to a rear surface (141) of the rear layer such that contact area there between are increased. The heat sink includes a plurality of heat conductive protrusions (151) on one surface thereof. The heat conductive protrusions are inserted into respective heat conductive depressions (142) formed in the rear layer. Each heat conductive depression has a shape corresponding to the respective heat conductive protrusion. Preferably, each heat conductive protrusion has a bar shape.