公开(公告)号：EP0158536B1

公开(公告)日：1991-10-23

申请号：EP85302477.6

申请日：1985-04-09

申请人： Moran, Peter Leslie

发明人： Moran, Peter Leslie

IPC分类号： H05K3/10 ,  C23C28/02 ,  C23F4/04

CPC分类号： C23F4/04 ,  C23C2/02 ,  H05K3/067 ,  H05K3/108 ,  H05K3/3468 ,  H05K2201/0305 ,  H05K2203/044 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T428/12396 ,  Y10T428/12493

公开(公告)号：EP0170477A3

公开(公告)日：1987-02-04

申请号：EP85305182

申请日：1985-07-22

申请人： Moran, Peter Leslie

发明人： Moran, Peter Leslie

IPC分类号： H01L23/52 ,  H01L21/48

CPC分类号： H05K3/385 ,  H01L21/4846 ,  H01L23/5283 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/4644 ,  Y10T29/49155 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A method of producing a multilayer system comprises depositing a seed layer (4) of copper on an electrically insulating substrate (2). A resist is formed on the copper seed layer (4), and the seed layer is electroplated with copper to produce a desired conductor pattern (8). An air firing dielectric (10) is screen printed over the pattern (8) and the exposed parts of the seed layer (4) are fired in air. The outer skin of the pattern is oxidised as is also the whole of the seed layer other than where it underlies the copper pattern. The oxidised regions of the copper both form a firm bond with the dielectric and inhibit the migration of oxgen into the inner regions of the conductor pattern (8). Also the oxidation of the seed layer renders it non-conductive and therefore obviates the need for its removal. Through holes 12 produced in the dielectric enable electrical connection to the pattern (8).

公开(公告)号：EP0158536A3

公开(公告)日：1987-09-23

申请号：EP85302477

申请日：1985-04-09

申请人： Moran, Peter Leslie

发明人： Moran, Peter Leslie

IPC分类号： H05K03/10 ,  C23C28/02 ,  C23F04/04

CPC分类号： C23F4/04 ,  C23C2/02 ,  H05K3/067 ,  H05K3/108 ,  H05K3/3468 ,  H05K2201/0305 ,  H05K2203/044 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T428/12396 ,  Y10T428/12493

摘要： A method of forming an electrically conductive pattern on a substrate includes the steps of forming a layer of gold (6) on an electrically insulating substrate (2) and coating the gold layer (6) with a photo-resist (8). The resist (8) is exposed to light through a photo mask and the exposed portions of the photo-resist (8) are selectively removed by etching. The now exposed parts of the gold layer (6) are coated with copper (12) and the remaining photo-resist (8) is removed. The exposed parts of the gold layer (6) and the copper (12) are subjected to molten tin (14) which simultaneously acts to dissolve the exposed parts of the gold layer (6) and to form an electrically conductive coating on the copper (12). The process enables the formation of a precise conductive pattern with enhanced reliability.

公开(公告)号：EP0170477A2

公开(公告)日：1986-02-05

申请号：EP85305182.9

申请日：1985-07-22

申请人： Moran, Peter Leslie

发明人： Moran, Peter Leslie

IPC分类号： H01L23/52 ,  H01L21/48

CPC分类号： H05K3/385 ,  H01L21/4846 ,  H01L23/5283 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/4644 ,  Y10T29/49155 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A method of producing a multilayer system comprises depositing a seed layer (4) of copper on an electrically insulating substrate (2). A resist is formed on the copper seed layer (4), and the seed layer is electroplated with copper to produce a desired conductor pattern (8). An air firing dielectric (10) is screen printed over the pattern (8) and the exposed parts of the seed layer (4) are fired in air. The outer skin of the pattern is oxidised as is also the whole of the seed layer other than where it underlies the copper pattern. The oxidised regions of the copper both form a firm bond with the dielectric and inhibit the migration of oxgen into the inner regions of the conductor pattern (8). Also the oxidation of the seed layer renders it non-conductive and therefore obviates the need for its removal. Through holes 12 produced in the dielectric enable electrical connection to the pattern (8).

公开(公告)号：EP0158536A2

公开(公告)日：1985-10-16

申请号：EP85302477.6

申请日：1985-04-09

申请人： Moran, Peter Leslie

发明人： Moran, Peter Leslie

IPC分类号： H05K3/10 ,  C23C28/02 ,  C23F4/04

CPC分类号： C23F4/04 ,  C23C2/02 ,  H05K3/067 ,  H05K3/108 ,  H05K3/3468 ,  H05K2201/0305 ,  H05K2203/044 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T428/12396 ,  Y10T428/12493

摘要： A method of forming an electrically conductive pattern on a substrate includes the steps of forming a layer of gold (6) on an electrically insulating substrate (2) and coating the gold layer (6) with a photo-resist (8). The resist (8) is exposed to light through a photo mask and the exposed portions of the photo-resist (8) are selectively removed by etching. The now exposed parts of the gold layer (6) are coated with copper (12) and the remaining photo-resist (8) is removed. The exposed parts of the gold layer (6) and the copper (12) are subjected to molten tin (14) which simultaneously acts to dissolve the exposed parts of the gold layer (6) and to form an electrically conductive coating on the copper (12).
The process enables the formation of a precise conductive pattern with enhanced reliability.