摘要:
A method and apparatus is disclosed for handling single in-line packaged (SIP) components (102) wherein the components are individually selected from a plurality of magazine supplies (90), transported to a gauging and testing station (10) at which the leads (106) thereof are straightened and aligned and electrical functioning of the component is tested, transferred from the testing station to an insert station below an insert head (60) by means of which the leads thereof are inserted into corresponding holes of a printed circuit board.
摘要:
A method and apparatus is disclosed for handling single in-line packaged (SIP) components (102) wherein the components are individually selected from a plurality of magazine supplies (90), transported to a gauging and testing station (10) at which the leads (106) thereof are straightened and aligned and electrical functioning of the component is tested, transferred from the testing station to an insert station below an insert head (60) by means of which the leads thereof are inserted into corresponding holes of a printed circuit board.