公开(公告)号：EP3877110A1

公开(公告)日：2021-09-15

申请号：EP19797693.9

申请日：2019-10-31

申请人： voestalpine Metal Forming GmbH

发明人： SOMMER, Andreas ,  WIEMANN, Marcus ,  GERSTNER, Florian

IPC分类号： B23C3/12 ,  B23C5/08 ,  B23K26/384 ,  B23D61/02 ,  B24D5/12 ,  B24D7/12 ,  B24D7/18

公开(公告)号：EP1513652A4

公开(公告)日：2008-07-16

申请号：EP03728857

申请日：2003-05-12

申请人： STRASBAUGH

发明人： BARBOUR GREG

IPC分类号： B24B49/00 ,  B24B49/12 ,  B24D7/12 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/205 ,  B24B49/12

摘要： A polishing pad (3) having an optical assembly (25) that does not cause excess wear on wafer workpiece. The optical assembly (25) is disposed within the pad (3) such that it may move in response to forces applied to the optical assembly (25).

公开(公告)号：EP1633528A4

公开(公告)日：2007-08-08

申请号：EP04733975

申请日：2004-05-19

申请人： EBARA CORP ,  SHIMADZU CORP

发明人： HIROKAWA KAZUTO ,  KOBAYASHI YOICHI ,  NAKAI SHUNSUKE ,  OHTA SHINROU ,  TSUKUDA YASUO

IPC分类号： B24B49/12 ,  B24B37/04 ,  B24D7/12 ,  H01L21/304 ,  H01L21/306

CPC分类号： B24B37/12 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625

摘要： A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.

公开(公告)号：EP1567306B1

公开(公告)日：2007-07-04

申请号：EP03809403.3

申请日：2003-10-06

申请人： Cabot Microelectronics Corporation

发明人： PRASAD, Abaneshwar, Cabot Microelectronic Corp.

IPC分类号： B24B37/04 ,  B24B49/12 ,  B24D7/12

CPC分类号： B24B37/24

摘要： The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of 0.01 microns to 1 micron. The polishing pad substrate has a light transmittance of 10% or more at least one wavelength of 200 nm to 35,000 nm. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.

公开(公告)号：EP1775071A1

公开(公告)日：2007-04-18

申请号：EP06024083.5

申请日：2003-11-21

申请人： UFI Schleiftechnik GmbH & Co. KG

发明人： Falk, Uli

IPC分类号： B24D7/06 ,  B24B55/10 ,  B24D7/12

CPC分类号： B24D7/12 ,  B24B55/102 ,  B24D7/06

摘要： Um den Luftfluss bzw. den Luftstrom zusammen mit dem Schleifstaub ungebrochen in die Durchbrechungen bzw. Öffnungen der Stützplatte (10) eines zur Drehmitnahme mit einer Antriebswelle verbundenen Schleiftellers (100) einer Schleifmaschine, wie Handschleifmaschine, zu leiten, wobei der beim Schleifen entstehende Schleifstaub (300) mittels mindestens einer in oder an der Schleifmaschine angeordneten Absaugglocke abgesogen wird, ist die Durchbrechung oder Öffnung (20) in der Stützplatte (10) aerodynamisch ausgebildet.

摘要翻译： 于空气流或空气流（用研磨粉不间断在穿孔或与连接至研磨机的研磨板（100）的驱动轴旋转驱动的支承板（10）的开口，例如要进行手工研磨机，将得到的在磨削屑一起 300）通过设置在上或研磨机吸入漏斗形的至少一个的装置吸入，通切割或在支撑板（10）开口（20）是空气动力学。

公开(公告)号：EP1506841B1

公开(公告)日：2007-02-21

申请号：EP03026759.5

申请日：2003-11-21

申请人： UFI Schleiftechnik GmbH & Co. KG

发明人： Falk, Uli

IPC分类号： B24D7/06 ,  B24B55/10 ,  B24D7/12

CPC分类号： B24D7/12 ,  B24B55/102 ,  B24D7/06

公开(公告)号：EP1176630A4

公开(公告)日：2005-11-30

申请号：EP00908067

申请日：2000-03-14

申请人： NIPPON KOGAKU KK

发明人： ISHIKAWA AKIRA ,  SENGA TATSUYA ,  MIYAJI AKIRA ,  USHIO YOSHIJIRO

IPC分类号： B24B37/013 ,  B24B37/20 ,  B24B49/04 ,  B24B49/12 ,  B24D7/12 ,  H01L21/304 ,  B24B37/04

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/04 ,  B24B49/12

摘要： After a hole is formed in the polishing pad 21, a transparent window plate 31 is inserted into this hole. Here, a gap a is left between the upper surface of the transparent window plate 31 and the outermost surface constituting the working surface of the polishing pad 21. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad 21 and transparent window plate 31 are compressed. In this case, Äthe system isÜ arranged so that the gap a remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate 31 is recessed from the upper surface of the polishing pad 21, there is no scratching of the surface of the transparent window plate 31 during dressing. Accordingly, the polishing pad has a long useful life.

公开(公告)号：EP1543921A1

公开(公告)日：2005-06-22

申请号：EP04030032.9

申请日：2004-12-17

申请人： EBARA CORPORATION

发明人： Nakao, Hidetaka, c/o Ebara Corporation ,  Kawabata, Yasumitsu, c/o Ebara Corporation ,  Katsumata, Yoshifumi, c/o Ebara Corporation ,  Ozawa, Naoki, c/o Ebara Corporation ,  Sasaki, Tatsuya, c/o Ebara Corporation ,  Shigeta, Atsushi, c/o Kabushiki Kaisha Toshiba

IPC分类号： B24B37/04 ,  B24B49/12 ,  B24D7/12

CPC分类号： B24B37/013 ,  B24B49/03 ,  B24B49/12

摘要： A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.

摘要翻译： 提供了一种用于防止过度抛光和研磨不足的基板抛光装置，并且能够定量设定额外的抛光时间。 基板抛光装置包括用于抛光待抛光的基板的机构; 用于测量沉积在基板上的薄膜的厚度的膜厚测量装置; 用于输入抛光薄膜的目标厚度的界面; 用于保存过去抛光结果的存储区域; 以及用于计算抛光时间和抛光速率的处理单元。 衬底抛光装置构建另外的抛光数据库，用于存储从存储区域中的附加抛光结果获取的数据。

公开(公告)号：EP1506841A1

公开(公告)日：2005-02-16

申请号：EP03026759.5

申请日：2003-11-21

申请人： UFI Schleiftechnik GmbH & Co. KG

发明人： Falk, Uli

IPC分类号： B24D7/06 ,  B24B55/10 ,  B24D7/12

CPC分类号： B24D7/12 ,  B24B55/102 ,  B24D7/06

摘要： Um den Luftfluss bzw. den Luftstrom zusammen mit dem Schleifstaub ungebrochen in die Durchbrechungen bzw. Öffnungen der Stützplatte (10) eines zur Drehmitnahme mit einer Antriebswelle verbundenen Schleiftellers (100) einer Schleifmaschine, wie Handschleifmaschine, zu leiten, wobei der beim Schleifen entstehende Schleifstaub (300) mittels mindestens einer in oder an der Schleifmaschine angeordneten Absaugglocke abgesogen wird, ist die Durchbrechung oder Öffnung (20) in der Stützplatte (10) aerodynamisch ausgebildet.

摘要翻译： 于空气流或空气流（用研磨粉不间断在穿孔或与连接至研磨机的研磨板（100）的驱动轴旋转驱动的支承板（10）的开口，例如要进行手工研磨机，将得到的在磨削屑一起 300）通过设置在上或研磨机吸入漏斗形的至少一个的装置吸入，通切割或在支撑板（10）开口（20）是空气动力学。

公开(公告)号：EP1296800A4

公开(公告)日：2003-08-06

申请号：EP00947036

申请日：2000-07-03

申请人： STRASBAUGH

发明人： WOLF STEPHAN H

IPC分类号： B24B49/00 ,  B24B49/12 ,  B24D13/14 ,  H01L21/304 ,  B24B37/04 ,  B24B49/04 ,  B24D7/12

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12

摘要： An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.