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公开(公告)号:EP4113086A1
公开(公告)日:2023-01-04
申请号:EP21206815.9
申请日:2021-11-05
发明人: CLOSE, Gael , DEGOIS, Jerome , DUPRÉ, Nicolas , LE SIGNOR, Théo , VENGERVEN, Tim
IPC分类号: G01L1/12 , G01L1/14 , G01L5/164 , G01L5/169 , G01L5/22 , B25J13/08 , G01G7/00 , G01G19/52 , A47J42/38
摘要: A weight sensor comprises a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece by a product due to the weight of said product, the displacement of the target piece with respect to sensing elements can be sensed.
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公开(公告)号:EP3821220B1
公开(公告)日:2024-11-13
申请号:EP19852765.7
申请日:2019-08-21
发明人: LENZI, Tommaso , GABERT, Lukas
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公开(公告)号:EP4303551A1
公开(公告)日:2024-01-10
申请号:EP22183416.1
申请日:2022-07-06
发明人: MANSOUR, Syrine , LE SIGNOR, Théo , CLOSE, Gael , LOMAKIN, Eugene
摘要: A sensor array for measuring a force is provided. The sensor array comprises a plurality of soft sensor elements, the soft sensor elements each comprising a sensor, a deformable element, wherein the deformable element is deformable by the force, and at least one element for reacting with the sensor for measuring the force by a deformation of the deformable element, wherein the deformable element extends at least partially between the sensor and the at least one element. Further, a method for measuring a force using a sensor array is provided.
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公开(公告)号:EP4327061A1
公开(公告)日:2024-02-28
申请号:EP22723609.8
申请日:2022-04-19
发明人: RIEß, Sebastian , KAAL, William
IPC分类号: G01L1/14 , G01L1/20 , G01L5/1623 , G01L5/164
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公开(公告)号:EP4113085A1
公开(公告)日:2023-01-04
申请号:EP21182116.0
申请日:2021-06-28
发明人: DUPRÉ, Nicolas , CLOSE, Gael , LE SIGNOR, Théo , VANGERVEN, Tim
摘要: A force sensor comprises a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece comprises the target, and it is attached to the semiconductor package, where the attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.
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