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    BUSBAR-FREE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND METHOD FOR CONNECTING BATTERY TO SOLDER RIBBON
    1.
    发明公开
    BUSBAR-FREE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND METHOD FOR CONNECTING BATTERY TO SOLDER RIBBON 审中-公开

    公开(公告)号：EP4451349A1

    公开(公告)日：2024-10-23

    申请号：EP23874250.6

    申请日：2023-06-21

    申请人： Zhejiang Znergy Solar Co., Ltd.

    发明人： DENG, Shifeng ,  SHI, Lei

    IPC分类号： H01L31/05 ,  H01L31/0224 ,  F16B11/00 ,  C09J7/10 ,  C09J7/38 ,  C09J123/08 ,  C09J129/14 ,  H01L31/0216 ,  H01L31/18 ,  B32B17/00 ,  B32B17/06 ,  B32B33/00

    摘要： Disclosed in the present invention are a busbar-free assembly and a manufacturing method therefor, and a method for connecting a battery to a solder ribbon. The busbar-free assembly comprises a battery, a solder ribbon arranged on the battery, an adhesive film covering the solder ribbon, and a cover plate covering the adhesive film, and further comprises a bonding mechanism arranged between the solder ribbon and the battery, wherein the bonding mechanism is transparent, so as to increase light transmittance. The battery and the solder ribbon are connected by means of an adhesive, the adhesive is coated on an inner end surface of the adhesive film, and the adhesive film corresponds to the battery in terms of size, thereby achieving the fixation of the solder ribbon and the battery, omitting a carrier, increasing light transmittance, improving generated power, and also preventing the adhesive from flowing into the space between the solder ribbon and the battery. When a substrate is used to fix the adhesive, the material of the substrate is consistent with the material of the adhesive film, which achieves high light transmittance and improves generated power.