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    RADIO FREQUENCY FILTER FOR AIRCRAFT NACELLE ACCESS DOOR GAP
    1.
    发明公开
    RADIO FREQUENCY FILTER FOR AIRCRAFT NACELLE ACCESS DOOR GAP 审中-公开

    公开(公告)号：EP4462971A1

    公开(公告)日：2024-11-13

    申请号：EP24163278.5

    申请日：2024-03-13

    申请人： The Boeing Company

    发明人： HWANG, Kyu-Pyung ,  MITCHUM, Thomas D. ,  BOETTCHER, Philipp Andreas ,  SONG, Young

    IPC分类号： H05K9/00

    摘要： An assembly for electromagnetic interference (EMI) shielding to prevent incident radiation from penetrating through a gap to an interior of an aircraft comprises an electromagnetic band gap (EBG) structure. The EBG structure has a patch-and-via array connected to a ground layer. The EMI shielding includes a conductive adhesive and is flexible for conforming attachment to curved aircraft surfaces. The shielding may be located on a deflector plate that is parallel to an adjacent aircraft surface, on the airframe surface opposite to the deflector plate, or in both locations. The assembly filters out penetrating electromagnetic energy and prevents highly resonant cavity mode buildups of electromagnetic energy inside a nacelle or other enclosure effectively protecting electrical equipment in the interior.

    DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES
    2.
    发明公开
    DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES 审中-公开

    公开(公告)号：EP4462970A2

    公开(公告)日：2024-11-13

    申请号：EP24202205.1

    申请日：2021-01-28

    申请人： Deere & Company

    发明人： SINGH, Brij N.

    IPC分类号： H05K7/20

    摘要： Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

    HEATING DEVICE
    4.
    发明公开
    HEATING DEVICE 审中-公开

    公开(公告)号：EP4462950A1

    公开(公告)日：2024-11-13

    申请号：EP23172379.2

    申请日：2023-05-09

    申请人： BorgWarner Inc.

    发明人： Casas, Julio ,  Viana, José ,  Muños, Mauricio ,  Ramírez, Luis ,  Pais, Pablo

    IPC分类号： H05B3/26 ,  F24H9/1818 ,  F24H1/12 ,  F24H1/00 ,  B60H1/22 ,  H01H33/59 ,  H05B1/02

    摘要： Disclosed is a heating device comprising a heating resistor assembly comprising a positive terminal (13), a negative terminal (14), and heating resistors (10, 10a, 10b) connected in series between the positive terminal (13) and the negative terminal (14), and a transistor switch (21) connected in series with the heating resistors (10). According the invention a first half (10a) of the heating resistors connects the positive terminal (13) to the transistor switch (21) and a second half (10b) of the heating resistors (10) connects the transistor switch (21) to the negative terminal (14).

    ELECTRONIC DEVICE COMPRISING TEMPERATURE SENSOR
    5.
    发明公开
    ELECTRONIC DEVICE COMPRISING TEMPERATURE SENSOR 审中-公开

    公开(公告)号：EP4462762A1

    公开(公告)日：2024-11-13

    申请号：EP23803763.4

    申请日：2023-05-04

    申请人： Samsung Electronics Co., Ltd

    发明人： JU, Wanjae

    IPC分类号： H04M1/03 ,  H04M1/02 ,  H05K5/06 ,  G06F1/16 ,  H04R1/08

    摘要： An electronic device according to an embodiment may comprise: a housing which includes a sound hole and a passage communicating with the sound hole; a PCB which is disposed within the housing and includes a first surface including an open region opposite to the passage, a second surface opposite to the first surface, and a PCB hole formed in the open region; a microphone element which is disposed on the PCB hole at the second surface of the PCB; a temperature sensor which is disposed at the side of the PCB hole in the open region of the first surface of the PCB and undergoes a change in the numerical value of the variation factor due to the temperature of air transferred through the passage; and a processor which detects a temperature outside the housing on the basis of a change in the numerical value of the variation factor of the temperature sensor.

    MODULAR AIR HANDLING UNIT (AHU) SYSTEM
    10.
    发明公开
    MODULAR AIR HANDLING UNIT (AHU) SYSTEM 审中-公开

    公开(公告)号：EP4447631A3

    公开(公告)日：2024-11-13

    申请号：EP24168279.8

    申请日：2024-04-03

    申请人： Vertiv Corporation

    发明人： RANCIC, Denis ,  MERKAS , Antonio ,  KUSEN, Vanja ,  PAJIC, Marin

    IPC分类号： H05K7/20 ,  H05K7/14

    摘要： The invention relates to a modular air handling unit (AHU) system including a set of cooling unit building blocks and a housing configured to house the set of cooling unit building blocks. The housing includes an air supply corridor configured to receive fresh air and an air return corridor configured to receive used air and distribute the received used throughout the set of cooling unit building blocks. Each cooling unit building block of the set of cooling unit building blocks includes an exchangeable air-conditioning (AC) section positioned proximate to the air supply corridor. The exchangeable AC section include an exchangeable AC assembly removably coupled to the exchangeable AC section. The exchangeable AC section include an array of supply fans configured to distribute the fresh air from the air supply corridor to the exchangeable AC assembly.