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公开(公告)号：JP2005516781A
公开(公告)日：2005-06-09
申请号：JP2003565686
申请日：2003-02-07
摘要： 【課題】 石材、レンガ、コンクリート、アスファルトのような脆性を有する被削材を切断したり穿孔するのに用いられるダイヤモンド工具用切削チップ及びダイヤモンド工具に関するものであって、ダイヤモンド粒子を適切に配列させることにより優れた切削性能を有するダイヤモンド工具用切削チップ及びこの切削チップを有するダイヤモンド工具を提供すること。
【解決手段】 ダイヤモンド粒子が分布されるダイヤモンド工具用切削チップにおいて、該ダイヤモンド粒子が切削面に平行な面において切削方向に対して傾き、切断時被削材に切削溝が連続的に重畳して形成されるよう配列されるダイヤモンド工具用切削チップ及びこの切削チップを有するダイヤモンド工具である。-
公开(公告)号：JP2005059164A
公开(公告)日：2005-03-10
申请号：JP2003294281
申请日：2003-08-18
发明人： TAKANO SEIJU
摘要： PROBLEM TO BE SOLVED: To provide an electro-deposition band saw having excellent performance, such as small processing damage to a cut material, sufficient surface roughness, suppressing of a crack of the outer periphery, smooth discharge of chips and smooth supply of grinding fluid, and sufficient sharpness.
SOLUTION: In the electro-deposition band saw, a super-abrasive grain layer is formed in an operating part by electro-deposition along one side edge of a flat metal endless belt. The super-abrasive grain layer is continuously formed over the whole periphery of the above-mentioned endless belt. The electro-deposition band saws are extended from the continuously formed super-abrasive grain layer at a predetermined interval to both surfaces of the endless belt in the width direction.
COPYRIGHT: (C)2005,JPO&NCIPI摘要翻译： 要解决的问题：提供一种具有优异性能的电沉积带锯，例如对切割材料的小的加工损伤，足够的表面粗糙度，抑制外周的裂纹，平滑的切屑放电和平稳的供给 的研磨液，并具有足够的清晰度。 解决方案：在电沉积带锯中，通过沿着平坦金属环形带的一个侧边缘的电沉积在操作部分中形成超磨料颗粒层。 超磨粒层在上述环形带的整个周边上连续地形成。 电沉积带锯从连续形成的超磨粒层以预定间隔延伸到环形带的宽度方向的两个表面。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2004174712A
公开(公告)日：2004-06-24
申请号：JP2004035780
申请日：2004-02-12
发明人： TSELESIN NAUM N
IPC分类号： B24D3/00 , B23D61/02 , B23D61/18 , B24D3/06 , B24D5/10 , B24D5/12 , B24D11/00 , B24D18/00 , B28D1/12 , C22C32/00
CPC分类号： B23D61/021 , B23D61/026 , B23D61/185 , B24D3/06 , B24D5/10 , B24D5/123 , B24D11/001 , B24D18/0072 , B28D1/121 , C22C32/00 , Y10T428/249957 , Y10T428/249969 , Y10T428/24997 , Y10T428/249974 , Y10T428/249976 , Y10T428/249982 , Y10T428/24999
摘要： PROBLEM TO BE SOLVED: To provide a patterned abrasive material and its manufacturing method. SOLUTION: According to this abrasive material, a base material 10 is coated with an adhesive 11, a hard particle 12 is brought into contact with the base material, and then all of particles not held with the adhesive are removed. Residual particles are surrounded by a firable or fusable material while the particles are temporarily held. The base material has an adhesive provided in a certain pattern in a manner to adhere the particles in a certain region for obtaining a desired pattern, or constantly covered and masked. While the particles are held on the base material, a physical force for orienting the particles is constantly provided. Then, the particles are provided, or the base material is provided on a preform. A continuous processing of heat and/or pressure completes the abrasive material. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2004001220A
公开(公告)日：2004-01-08
申请号：JP2003171988
申请日：2003-06-17
申请人： Rin Soon Park , パク, リン スーン
发明人： PARK RIN SOON
IPC分类号： B23D61/04 , B22F3/02 , B22F7/00 , B22F7/08 , B23D61/00 , B23D61/18 , B23D65/00 , B23P15/28 , B24D3/00 , B24D3/06 , B24D5/06 , B24D5/12 , B24D18/00 , B28D1/04 , C22C1/05
CPC分类号： B22F3/02 , B22F7/08 , B22F2005/001 , B22F2999/00 , B23P15/28 , B24D5/06 , B24D18/0009
摘要： PROBLEM TO BE SOLVED: To disclose a cutting saw provided with a cutting segment with diamond particles distributed uniformly therein.
SOLUTION: The manufacturing method of the cutting saw comprises the steps of: preparing mixture of diamond and metal powder, locating and supporting a disc-type steel body 131 of the cutting saw at the lower part of molding dies 111, 112; throwing a determined amount of the mixture of diamond and metal powder into a molding pattern 103 to mold the cutting segment of a determined shape; heating the mixture of diamond and metal powder molded in the molding pattern 103 to sinter the metal powder therein; and connecting the cutting segment with the periphery of the disc-type steel body 131 through the heating.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP3381793B2
公开(公告)日：2003-03-04
申请号：JP51050194
申请日：1993-10-26
申请人： ユミコレ
发明人： キュリー，ジョン，シー． , サザランド，ブルース，アール． , シェイエ，ヒュー，シー．
IPC分类号： B22F9/26 , B22F9/24 , B23D61/18 , B24D3/06 , B24D3/10 , C22B20060101 , C22B3/26 , C22B3/44 , C22B23/00 , C22C19/07 , C22C26/00
CPC分类号： C22B23/0461
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公开(公告)号：JP2001300848A
公开(公告)日：2001-10-30
申请号：JP2000116495
申请日：2000-04-18
申请人： TODA CONSTRUCTION
摘要： PROBLEM TO BE SOLVED: To automatically recover or keep the cutting quality when the cutting quality of a wire saw reduces in renewing dismantling work in a narrow space and dismantling work of a radioactive ray forming part of a nuclear power plant in a dressing device in a wire saw cutter for cutting, for example, concrete at a high speed. SOLUTION: This dressing device 1 can freely move so as to abut to and separate from the wire saw 12, and is formed by arranging at least a poishing device 5 for grinding diamond of a bead.
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公开(公告)号：JP2000246542A
公开(公告)日：2000-09-12
申请号：JP10044099
申请日：1999-03-02
申请人： OSAKA DIAMOND IND
发明人： YAMANAKA MASAAKI , OGAWA HIDEKI , URAKAWA NOBUO , HARA AKIO
摘要： PROBLEM TO BE SOLVED: To enhance the bondability with resin bond by coating super abrasive grain such as diamond, CBN, etc., with metal and to suppress the heat deterioration of the resin bond by releasing the grinding heat generated in cutting operation by the coating metal. SOLUTION: A core 1 formed by primer coating epoxy resin on a copper plated piano wire with the thickness approximately 2 μm is prepared, phenol resin, diamond filler of mean grain size approximately 2.6 μm, NI plating coated diamond abrasive grain of the mean grain size approximately 25 μm are mixed together, and cresol is added to the mixture to prepare the coating. The coating is baked on the core 1 to be hardened. Because the metal coated abrasive grain 3 is used, the resin is generated protrusions 6 along the abrasive grain 3 top by the wettability and the bondability of the coated metal and the resin so that even if the resin bond layer thickness between the abrasive grains 3 becomes thin, it can exhibit abrasive grain holding capacity and if the thickness (t) of the bond layer is 1/3-2/3 of the abrasive grain, it can exhibit sufficient holding force.
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